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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Cadence, Autodesk Collaborate on Smart Product Design
November 14, 2023 | Cadence Design Systems, Inc.Estimated reading time: 1 minute
Cadence Design Systems, Inc. announced a collaboration with Autodesk to provide solutions that accelerate intelligent system design leveraging Autodesk Fusion and Cadence® PCB solutions. This new integration offers customers seamless collaboration between electronic and mechanical engineering to accelerate the development of smart products through efficient co-design.
Electrical and mechanical engineers face increased pressure to produce products with fewer revisions, making efficient collaboration key to delivering smart products to market on time. Current manual design data methods require users to exchange files that can differ from design intent, resulting in errors, unnecessary re-work and costly delays.
To address these challenges, the companies have integrated Autodesk Fusion with Cadence’s Allegro® X and OrCAD® X platforms into a solution that enables seamless bi-directional communication between PCB designers and mechanical engineers. The platform integration enables companies to take full advantage of cloud-based mechanical design and generative AI/ML PCB design, while fully leveraging multiphysics analysis for power, thermal, electromagnetics and more.
“The electronics industry is being disrupted on multiple fronts including supply chain challenges and rapidly accelerating product complexity,” said Tom Beckley, senior vice president, Cadence. “Our partnership with Autodesk provides access to leading-edge technology for electronic design integrated with Autodesk’s leading cloud-enabled, connected mechanical CAD solutions.”
“Our partnership with Cadence powers a seamless collaboration between mechanical and electronics design, putting customers at the center,” said Jeff Kinder, executive vice president, Autodesk. “Manufacturers need to bring more complex products to the market faster – all while juggling distributed teams, supply chain disruptions, and costs. This integration further extends Autodesk’s vision to connect end-to-end design and make processes in manufacturing.”
The AI-based Allegro X and OrCAD X platforms support Cadence’s Intelligent System Design™ strategy, which enables customers to accelerate system innovation.
Suggested Items
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
Elementary Mr. Watson: Retro Routers vs. Modern Boards—The Silent Struggle on Your Screen
06/26/2025 | John Watson -- Column: Elementary, Mr. WatsonThere's a story about a young woman preparing a holiday ham. Before putting it in the pan, she cuts off the ends. When asked why, she shrugs and says, "That's how my mom always did it." She asks her mother, who gives the same answer. Eventually, the question reaches Grandma, who laughs and says, "Oh, I only cut the ends off because my pan was too small." This story is a powerful analogy for how many PCB designers approach routing today.
Connect the Dots: The Future of PCB Design and Manufacturing
07/02/2025 | Matt Stevenson -- Column: Connect the DotsFor some time, I have been discussing the increasing complexity of PCBs and how designers can address the constantly evolving design requirements associated with them. My book, "The Printed Circuit Designer’s Guide to… Designing for Reality," details best practices for creating manufacturable boards in a modern production environment.
Siemens Turbocharges Semiconductor and PCB Design Portfolio with Generative and Agentic AI
06/24/2025 | SiemensAt the 2025 Design Automation Conference, Siemens Digital Industries Software today unveiled its AI-enhanced toolset for the EDA design flow.
Cadence AI Autorouter May Transform the Landscape
06/19/2025 | Andy Shaughnessy, Design007 MagazinePatrick Davis, product management director with Cadence Design Systems, discusses advancements in autorouting technology, including AI. He emphasizes a holistic approach that enhances placement and power distribution before routing. He points out that younger engineers seem more likely to embrace autorouting, while the veteran designers are still wary of giving up too much control. Will AI help autorouters finally gain industry-wide acceptance?