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Semiwise, sureCore,, Cadence Showcase Breakthrough in Cryogenic CMOS Circuit Development

06/21/2024 | Cadence Design Systems, Inc.
In a leap towards revolutionizing quantum computing and enhancing the energy efficiency of data centers, Semiwise, sureCore, and Cadence have collaborated to overcome critical challenges in developing cryogenic CMOS circuits.

Lockheed Martin Selected To Develop Next Generation Weather Satellite Constellation

06/20/2024 | Lockheed Martin
NASA has selected Lockheed Martin to develop and build the nation's next generation weather satellite constellation, Geostationary Extended Observations (GeoXO), for the National Oceanic and Atmospheric Administration (NOAA).

Ansys to Demonstrate 3D Multiphysics Visualization of Electromagnetic and Thermal Effects in Semiconductor Packages at Design Automation Conference

06/20/2024 | ANSYS
Ansys announced that it is adopting NVIDIA Omniverse application programming interfaces (APIs) to offer 3D-IC designers valuable insights from Ansys’ physics solver results through real-time visualization. Ansys announced that it is adopting NVIDIA Omniverse application programming interfaces (APIs) to offer 3D-IC designers valuable insights from Ansys’ physics solver results through real-time visualization.

Elementary, Mr. Watson: Cultivating a Culture of Collaboration

06/20/2024 | John Watson -- Column: Elementary, Mr. Watson
About three years ago, I wrote a column, “PCB Design—It's a Team Sport,” which discussed the importance of collaboration and working as a team. At that time, we were under restrictions due to the COVID pandemic and were coming to grips with our new roles and struggles as PCB designers. I opened my column by stating, "Our entire industry had to reinvent how we did things. It's during the difficult times the most valuable lessons are learned." While 2021 seems like another lifetime ago, those lessons still linger.

Connect the Dots: Designing for Reality—Lamination and Materials

06/19/2024 | Matt Stevenson -- Column: Connect the Dots
As many of you have likely figured out, I am quite passionate about the subject of designing PCBs for the reality of manufacturing. I wrote a book about it and I participate in an I-Connect007 On the Line with… podcast series dedicated to the subject. This companion article will focus on multilayer lamination, keeping the bigger picture in mind: Realistic PCB designs should prioritize manufacturability and reliability of the PCB as well as meet the other design requirements. So, one must account for the production variables associated with individual manufacturing partners.
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