NextFlex Announces $6.5M Funding for Flexible Hybrid Electronics Innovations in Extreme Environments and Sustainability
November 15, 2023 | BUSINESS WIREEstimated reading time: 1 minute
NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Innovation Institute, announced $6.49M in funding (including $3.29M in cost-share contribution from participants) for seven new projects as part of its Project Call 8.0 to further promote FHE development and adoption throughout the U.S. advanced manufacturing sector.
The awarded projects represent a diverse and innovative set of companies and universities that are collaboratively focused on maturing the industry’s capabilities while leveraging the strong foundation established in prior Project Calls. Project Call 8.0 emphasizes projects that address critical hybrid electronics manufacturing challenges, enabling the transition of FHE devices into applications that require superior performance and assured reliability. Several projects selected address critical needs in domestic advanced semiconductor packaging capabilities, which directly aligns with technical areas of interest outlined in the CHIPS Program.
Project Call 8.0 also focuses on using hybrid electronics manufacturing processes and materials to improve environmental sustainability in electronics manufacturing. This will include maturation of processes using biodegradable and recyclable substrates, low temperature cure water-based inks, and electronics recycled / reworked for reduced E-waste production.
This latest round of funding brings the total amount invested in FHE developments to more than $134M, including cost-share contributions from Project Call participants.
“This round of projects will build on our work in previous Project Calls as we continue to push U.S.-based hybrid electronics manufacturing forward in key areas,” said Scott M. Miller, PhD, NextFlex Director of Technology. “These projects address important needs and opportunities in environmentally sustainable electronics manufacturing, additive electronics packaging, and advancing the manufacturing readiness level of critical processes.”
Project Call 8.0’s funding awards will go to:
- Lockheed Martin and Binghamton University for advancing high resolution copper printing for RF antenna and multi-layer balun structures.
- Two projects led by The Boeing Company for maturing additive die packaging for cryogenic and high temperature operations and develop sustainable additive printing and production of hybrid integrated receiver electronics & sensors.
- GE Research and Binghamton University for developing and demonstrating the reliability of additively packaged microelectromechanical systems inertia measurements units for harsh environments.
- Auburn University for leading two projects focused on further maturing and demonstrating in-mold flexible electronics reliability for harsh automotive applications and biodegradable substrates, low-temperature cure water-based inks, room temperature interconnects, and rework for sustainable electronics.
- Iowa State University for validation and technology maturation of real-time process monitoring and control for aerosol jet printed electronics.
Suggested Items
Seeing a Future in Mexico
07/09/2025 | Michelle Te, I-Connect007The Global Electronics Association (formerly known as IPC) has been instrumental in fostering a partnership with Guanajuato, a state north of Mexico City with 12 industrial clusters and close to 150 companies involved in electronics. This past spring, Alejandro Hernández, the undersecretary for investment promotion in Guanajuato, attended IPC APEX EXPO 2025 at the invitation of IPC Mexico Director Lorena Villanueva, where he met with several companies to discuss the opportunities available in Mexico. He is inviting electronics-related companies seeking long-term investment in a centrally located area with access to highways, railways, and ports.
Webinar Review: A Global Trade and Economy in Flux
07/09/2025 | I-Connect007 Editorial TeamIn a July 8 webinar, Global Electronics Association Chief Economist Shawn DuBravac provided a comprehensive analysis of the evolving international trade environment, its implications for inflation, monetary policy, and labor dynamics, and a sober assessment of market valuations. In “Navigating a Shifting Landscape” DuBravac painted a picture of a global economy in flux, where shifting trade alliances and tariff structures are redrawing the supply chain map and influencing the broader economic landscape, while also conveying an overall bullish market outlook.
Arrow Electronics Launches Engineering Solutions Center to Support Tech Innovation Across India and Southeast Asia
07/09/2025 | Arrow ElectronicsArrow Electronics, a global provider of technology solutions, announced the launch of its new Engineering Solutions Center(ESC) in Bangalore, India.
LITEON Technology Reports Consolidated June Sales of NT$13.6 Billion, Up 16% Y-o-Y
07/08/2025 | LITEON TechnologyLITEON Technology reported its June consolidated revenue of NT$13.6 billion. Thanks to the growth from power management in cloud computing, advanced server, and networking, the revenue is up 2% M-o-M, 16% Y-o-Y. The cumulative sales for January to June totaled NT$76.8 billion, up 24%, Y-o-Y.
Niche Electronics Announces Major Manufacturing Upgrade
07/08/2025 | Niche ElectronicsNiche Electronics, a leading electronics manufacturing services company, announced today that it has completed installation of Yamaha’s newest SMT lineup at its Pennsylvania production facility.