NextFlex Announces $6.5M Funding for Flexible Hybrid Electronics Innovations in Extreme Environments and Sustainability
November 15, 2023 | BUSINESS WIREEstimated reading time: 1 minute
NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Innovation Institute, announced $6.49M in funding (including $3.29M in cost-share contribution from participants) for seven new projects as part of its Project Call 8.0 to further promote FHE development and adoption throughout the U.S. advanced manufacturing sector.
The awarded projects represent a diverse and innovative set of companies and universities that are collaboratively focused on maturing the industry’s capabilities while leveraging the strong foundation established in prior Project Calls. Project Call 8.0 emphasizes projects that address critical hybrid electronics manufacturing challenges, enabling the transition of FHE devices into applications that require superior performance and assured reliability. Several projects selected address critical needs in domestic advanced semiconductor packaging capabilities, which directly aligns with technical areas of interest outlined in the CHIPS Program.
Project Call 8.0 also focuses on using hybrid electronics manufacturing processes and materials to improve environmental sustainability in electronics manufacturing. This will include maturation of processes using biodegradable and recyclable substrates, low temperature cure water-based inks, and electronics recycled / reworked for reduced E-waste production.
This latest round of funding brings the total amount invested in FHE developments to more than $134M, including cost-share contributions from Project Call participants.
“This round of projects will build on our work in previous Project Calls as we continue to push U.S.-based hybrid electronics manufacturing forward in key areas,” said Scott M. Miller, PhD, NextFlex Director of Technology. “These projects address important needs and opportunities in environmentally sustainable electronics manufacturing, additive electronics packaging, and advancing the manufacturing readiness level of critical processes.”
Project Call 8.0’s funding awards will go to:
- Lockheed Martin and Binghamton University for advancing high resolution copper printing for RF antenna and multi-layer balun structures.
- Two projects led by The Boeing Company for maturing additive die packaging for cryogenic and high temperature operations and develop sustainable additive printing and production of hybrid integrated receiver electronics & sensors.
- GE Research and Binghamton University for developing and demonstrating the reliability of additively packaged microelectromechanical systems inertia measurements units for harsh environments.
- Auburn University for leading two projects focused on further maturing and demonstrating in-mold flexible electronics reliability for harsh automotive applications and biodegradable substrates, low-temperature cure water-based inks, room temperature interconnects, and rework for sustainable electronics.
- Iowa State University for validation and technology maturation of real-time process monitoring and control for aerosol jet printed electronics.
Suggested Items
LITEON Technology Reports Consolidated June Sales of NT$13.6 Billion, Up 16% Y-o-Y
07/08/2025 | LITEON TechnologyLITEON Technology reported its June consolidated revenue of NT$13.6 billion. Thanks to the growth from power management in cloud computing, advanced server, and networking, the revenue is up 2% M-o-M, 16% Y-o-Y. The cumulative sales for January to June totaled NT$76.8 billion, up 24%, Y-o-Y.
Niche Electronics Announces Major Manufacturing Upgrade
07/08/2025 | Niche ElectronicsNiche Electronics, a leading electronics manufacturing services company, announced today that it has completed installation of Yamaha’s newest SMT lineup at its Pennsylvania production facility.
Hon Hai Reports New June Sales High Amid AI Boom
07/07/2025 | I-Connect007 Editorial TeamTaiwan-based manufacturing giant Hon Hai Precision Industry Co. reported on July 5 that its sales for June rose 10 percent from the previous year, driven by cloud and networking growth because of the boom in artificial intelligence (AI), the Taipei Times reported.
Electronics Industry Wrestles with Cost Pressures and Weaker Profitability
07/07/2025 | Global Electronics AssociationElectronics manufacturers are facing rising material and labor costs according to the Global Electronics Association’s June Sentiment of the Global Electronics Manufacturing Supply Chain Report.
Naprotek Appoints James Eisenhaure as Chief Financial Officer
07/07/2025 | Naprotek LLCNaprotek, LLC, a leading provider of mission-critical electronics technology solutions, today announced that James Eisenhaure has been appointed Chief Financial Officer, effective June 30. Eisenhaure has been serving as interim CFO since earlier this year and now formally steps into the role.