It’s Only Common Sense: Hire for Hunger, Train for Skill
Dan’s Biz Bookshelf: ‘The 'NVIDIA Way: Jensen Huang and the Making of a Tech Giant’
NextFlex Announces $6.5M Funding for Flexible Hybrid Electronics Innovations in Extreme Environments and Sustainability
November 15, 2023 | BUSINESS WIREEstimated reading time: 1 minute
NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Innovation Institute, announced $6.49M in funding (including $3.29M in cost-share contribution from participants) for seven new projects as part of its Project Call 8.0 to further promote FHE development and adoption throughout the U.S. advanced manufacturing sector.
The awarded projects represent a diverse and innovative set of companies and universities that are collaboratively focused on maturing the industry’s capabilities while leveraging the strong foundation established in prior Project Calls. Project Call 8.0 emphasizes projects that address critical hybrid electronics manufacturing challenges, enabling the transition of FHE devices into applications that require superior performance and assured reliability. Several projects selected address critical needs in domestic advanced semiconductor packaging capabilities, which directly aligns with technical areas of interest outlined in the CHIPS Program.
Project Call 8.0 also focuses on using hybrid electronics manufacturing processes and materials to improve environmental sustainability in electronics manufacturing. This will include maturation of processes using biodegradable and recyclable substrates, low temperature cure water-based inks, and electronics recycled / reworked for reduced E-waste production.
This latest round of funding brings the total amount invested in FHE developments to more than $134M, including cost-share contributions from Project Call participants.
“This round of projects will build on our work in previous Project Calls as we continue to push U.S.-based hybrid electronics manufacturing forward in key areas,” said Scott M. Miller, PhD, NextFlex Director of Technology. “These projects address important needs and opportunities in environmentally sustainable electronics manufacturing, additive electronics packaging, and advancing the manufacturing readiness level of critical processes.”
Project Call 8.0’s funding awards will go to:
- Lockheed Martin and Binghamton University for advancing high resolution copper printing for RF antenna and multi-layer balun structures.
- Two projects led by The Boeing Company for maturing additive die packaging for cryogenic and high temperature operations and develop sustainable additive printing and production of hybrid integrated receiver electronics & sensors.
- GE Research and Binghamton University for developing and demonstrating the reliability of additively packaged microelectromechanical systems inertia measurements units for harsh environments.
- Auburn University for leading two projects focused on further maturing and demonstrating in-mold flexible electronics reliability for harsh automotive applications and biodegradable substrates, low-temperature cure water-based inks, room temperature interconnects, and rework for sustainable electronics.
- Iowa State University for validation and technology maturation of real-time process monitoring and control for aerosol jet printed electronics.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Spirit Electronics Named Authorized Distributor for Microchip Technology
04/17/2026 | Globe NewswireSpirit Electronics, a vertically integrated electronics design and manufacturing solutions provider serving the military and aerospace markets, announced that it has been designated as an authorized distributor for the Americas for Microchip Technology, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions.
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.
The Global Electronics Association Is Future Forward
04/17/2026 | Real Time with... APEX EXPOJohn W. Mitchell, CEO of the Global Electronics Association, discusses the association's comprehensive role in standards, training, sustainability, and global advocacy. He highlights the industry's critical importance and the association's efforts in workforce development and adapting to AI. The conversation also touches on future trends like personal robotics and innovative approaches to industry standards.
MEIKO Electronics Expands ASEAN Footprint with New Vietnam Subsidiary to Support Growing Demand
04/16/2026 | MeikoMEIKO ELECTRONICS CO., LTD. has announced that, at its Board of Directors meeting held on April 8, 2026, the company resolved to establish a wholly owned subsidiary, MEIKO ELECTRONICS YEN QUANG CO., LTD. (MKYQ), in Phu Tho Province, Vietnam.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.