-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Registration Sweet Spot
Registration is underrated and underappreciated. The key is to ensure proper registration from layer to layer across the entire printed circuit board. It’s a holistic process requiring anticipation, prediction, precise attention at each step, and detailed data tracking and monitoring.
High-reliability Fabrication
In this month’s issue, our expert contributors discuss the latest in technologies, trends, complexities and resources regarding high-reliability fabrication.
Finding Ultra
New demands on PCB fabrication, namely advanced packaging, ultra high density interconnect (UHDI), and new specialty materials, are converging, changing the landscape of our business. Is it time to start paying close attention to this convergence?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
DOD Awards $39.9 Million to Strengthen U.S. Supply Chains for PCBs
November 16, 2023 | U.S. DoDEstimated reading time: Less than a minute
The Department of Defense announced an award of $39.9 million via the Defense Production Act Investment (DPAI) Program to Calumet Electronics Corporation to enhance capabilities to produce High-Density Build-Up (HDBU) substrates, which include High-Density Interconnect Printed Circuit Board (PrCB) cores and HDBU build-up layers.
"The Biden Administration has prioritized the need to support and advance the domestic PrCB and advanced packaging industrial base," said Dr. Laura Taylor-Kale, Assistant Secretary of Defense for Industrial Base Policy. "These technologies are critical for modern weapons systems and will contribute to maintaining our warfighting edge over potential adversaries."
The award will enable Calumet to scale up engineering, tooling, and manufacturing operations to establish domestic production capabilities for HDBU substrates. HDBU substrates and advanced packaging are critical enabling technologies for sixth generation systems and applications, including for radar, electronic warfare, processing, and communications. The place of performance is Calumet, Michigan.
To date, in calendar year 2023, the DPAI Program has made 22 awards totaling $714 million. DPAI is overseen by the ASD(IBP)’s Manufacturing Capability Expansion and Investment Program (MCEIP), in the Office of the Deputy Assistant Secretary of Defense for Industrial Base Resilience.
Suggested Items
U.S. Partnership for Assured Electronics Awards Nearly $10M to 7 Microelectronics Firms
12/04/2023 | USPAESeven microelectronics firms received nearly $10 million in combined funding to commercialize technologies of interest to the U.S. military services as winners of the Defense Business Accelerator (DBX) Microelectronics Challenge. This groundbreaking initiative is funded by the Department of Defense (DoD) and led by the U.S. Partnership for Assured Electronics (USPAE).
$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US
11/27/2023 | PRNewswireMicross Components, a leading provider of high-reliability microelectronic products and services for aerospace, defense, space, medical, energy, and other high-reliability applications, is pleased to announce that it has received an award under the IBAS Cornerstone RESHAPE program with a ceiling value of up to $134.3 million, with $45.6 million obligated at the time of the award.
Statement of Support from IPC for New Actions to Strengthen America’s Supply Chains, Lower Costs for Families, and Secure Key Sectors
11/27/2023 | IPCIPC welcomes the actions outlined today by the U.S. Government “to strengthen supply chains critical to America’s economic and national security.”
HyRel Technologies Attains ITAR Registration, Reinforcing Leadership in Robotic Solder Component Tinning
11/27/2023 | HyRelHyRel Technologies, a global provider of quick turn semiconductor modification solutions, announces the achievement of International Traffic in Arms Regulations (ITAR) registration.
Live-fire Test Success for RTX's Raytheon Lower Tier Air and Missile Defense Sensor
11/22/2023 | RTXRaytheon, an RTX business, in support of the U.S. Army, completed a live-fire engagement using the advanced, 360-degree Lower Tier Air and Missile Defense Sensor, known as LTAMDS.