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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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DOD Awards $39.9 Million to Strengthen U.S. Supply Chains for PCBs
November 16, 2023 | U.S. DoDEstimated reading time: Less than a minute
The Department of Defense announced an award of $39.9 million via the Defense Production Act Investment (DPAI) Program to Calumet Electronics Corporation to enhance capabilities to produce High-Density Build-Up (HDBU) substrates, which include High-Density Interconnect Printed Circuit Board (PrCB) cores and HDBU build-up layers.
"The Biden Administration has prioritized the need to support and advance the domestic PrCB and advanced packaging industrial base," said Dr. Laura Taylor-Kale, Assistant Secretary of Defense for Industrial Base Policy. "These technologies are critical for modern weapons systems and will contribute to maintaining our warfighting edge over potential adversaries."
The award will enable Calumet to scale up engineering, tooling, and manufacturing operations to establish domestic production capabilities for HDBU substrates. HDBU substrates and advanced packaging are critical enabling technologies for sixth generation systems and applications, including for radar, electronic warfare, processing, and communications. The place of performance is Calumet, Michigan.
To date, in calendar year 2023, the DPAI Program has made 22 awards totaling $714 million. DPAI is overseen by the ASD(IBP)’s Manufacturing Capability Expansion and Investment Program (MCEIP), in the Office of the Deputy Assistant Secretary of Defense for Industrial Base Resilience.
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