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ITEN, A*STAR IME Announce Breakthrough in Solid-State Battery Integration for Advanced Packaging

05/15/2025 | BUSINESS WIRE
ITEN, a global leader in micro solid-state batteries, and A*STAR Institute of Microelectronics (A*STAR IME), a leader in advanced packaging research, have announced a groundbreaking achievement for the integration of ITEN’s micro batteries using A*STAR IME’s cutting-edge advanced packaging platform.

ASMPT Presents Die Bonder with Intelligent Features

05/14/2025 | ASMPT
ASMPT, the leading supplier of production equipment for advanced packaging and semiconductor assembly, introduces its flagship INFINITE bonder, which achieves top performance in throughput and quality.

Rheinmetall, ICEYE Sign MoU to Establish Joint Venture

05/14/2025 | Rheinmetall
Rheinmetall and globally leading SAR satellite manufacturer ICEYE are further intensifying their cooperation. The two companies intend to establish a joint venture for satellite production. A memorandum of understanding to this effect was signed on 8 May 2025.

Merlin Circuit Technology Earns NADCAP 2nd Year Merit

05/13/2025 | Merlin Circuit Technology
Merlin Circuit Technology Ltd, a leading manufacturer of advanced printed circuit boards (PCBs) for mission-critical applications, has announced the successful completion of its latest NADCAP audit, achieving prestigious 2nd Year Merit Status.

Top 10 OSAT Companies of 2024 Revealed—China Players See Double-Digit Growth, Reshaping the Global Market Landscape

05/13/2025 | TrendForce
TrendForce’s latest report on the semiconductor packaging and testing (OSAT) sector reveals that the global OSAT industry in 2024 faced dual challenges from accelerating technological advancements and ongoing industry consolidation.
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