Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Dana on Data: Merging 2D Electrical, 3D Mechanical Worlds

12/04/2024 | Dana Korf -- Column: Dana on Data
Imagine the day when placing components and routing signal traces and power planes are not constrained by 2D PCB fabrication processes and materials. Astronauts working on the space station have equipment mounted on all axes. They are not constrained by having to stand on a flat surface. They already have a 3D printer at the space station. Why can’t we create PCBs in a 3D space?

ROHM Semiconductor, Valeo Co-Develop the Next Generation of Power Electronics

12/03/2024 | Globe Newswire
ROHM Semiconductor and Valeo, a leading automotive technology company, today announced they are collaborating to propose and optimize the next generation of power modules for electric motor inverters using their combined expertise in power electronics management

Beyond Design: High-speed Rules of Thumb

11/21/2024 | Barry Olney -- Column: Beyond Design
The idiom “rule of thumb” is often used in electronics design and has its origins in the practice of measuring roughly with one’s thumb. Rules of thumb are easy-to-remember, broadly accurate guides or principles based on practice rather than theory. They are used to help feed our intuition to find a quick solution based on experience. We are often forced to use rules of thumb in PCB design in the absence of expensive analysis tools. We also use them to get quick ballpark figures initially and then fine-tune the numbers with further analysis. We can use rules of thumb as a sanity check to assess whether we are using our tools correctly. In this month’s column, I will present some commonly used and helpful rules for high-speed PCB design.

ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production

11/20/2024 | ASMPT
The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.

SEMI Europe Recognizes Schneider Electric as a Leader in Diversity and Inclusion at SEMICON Europa 2024

11/14/2024 | SEMI
SEMI Europe and the SEMI European Advisory Council for Diversity and Inclusion announced Schneider Electric as the recipient of the 2023 SEMI Industry Leader in Diversity and Inclusion Award. Frederic Godemel, Executive Vice President, Power Systems and Services at Schneider Electric accepted the award presented at SEMICON Europa 2024 during the SEMI Networking Night Dinner.  
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in