Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
SEL Receives 2023 Top Project of the Year Award for PCB Factory
November 22, 2023 | Schweitzer Engineering LaboratoriesEstimated reading time: 1 minute
Schweitzer Engineering Laboratories (SEL), a global leader in products and solutions that protect and control electric power systems, earned the 2023 Top Project of the Year award by the Idaho Business Review last week at Idaho’s 2023 Top Projects award ceremony in Boise. The SEL printed circuit board (PCB) factory at Schwartz Campus in Moscow, Idaho, was selected for the top honor from 36 construction projects in Idaho.
According to an Idaho Business Review Editor Matt Lutz, Idaho's 2023 Top Projects awards celebrate construction projects, developers and contractors that have gone above and beyond. Winners are selected due to their ability to overcome challenges, adhere to budget/time constraints and provide quality products and services.
“SEL employee owners from across our company worked hard and collaborated with many to get this project done—all on our own dime without any help from the government,” said SEL Founder and President Edmund O. Schweitzer, III. “We committed to each other to do it right, and now we are safely producing the highest-quality printed circuit boards in the cleanest plant, using the fewest resources that science and engineering afford us today. This is $100M of employee owners’ money well spent on creating our future right here in America.”
Winners were selected by an expert panel of local judges, including representatives from academia, the business sector and industry associations. Projects were judged based on the following criteria:
- Scope of work
- Challenges and obstacles
- Budget and schedule
- Overall quality
SEL has been recognized for its commitment to ensuring the factory and processes are at the forefront of innovative and environmentally friendly PCB fabrication. The company recently received the 2023 Environmental Excellence Award from the Idaho Association of Commerce and Industry and was named a 2023 Pollution Prevention Champion by the Idaho Department of Environmental Quality.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.