It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Alpha Insights, Performance by Design: The Future of PCB Manufacturing in the Midwest
Happy’s Tech Talk #43: Engineering Statistics Training With Free Software
ViTrox's Cutting-Edge V510i 3D AOI Wins the 2023 Global Technology Award, Redefining Inspection Excellence
November 23, 2023 | ViTroxEstimated reading time: 2 minutes
ViTrox, which aims to be the world’s most trusted technology company, is honoured to announce that our latest V510i Advanced 3D Optical Inspection (AOI) Solution for Advanced Packaging has been awarded a 2023 Global Technology Award, in the Inspection - AOI category, from Global SMT & Packaging. The award was announced during the award ceremony at Productronica in Munich, Germany, on November 14, 2023.
With the pioneer integration of Artificial Intelligence (A.I.) technologies and extensive inspection capability, our V510i 3D AOI Solution for Advanced Packaging marks a significant shift in inspection for the semiconductor and SMT industry, especially for highly reflective die and components. One significant breakthrough technology is the Surface Defect Inspection (SDI) algorithm, which enables this V510i 3D AOI solution to offer extensive inspection coverage, including die placement, die coplanarity, die chip-off/crack, die polarity, surface defects on die (such as scratches and contamination), gold pad surfaces, foreign material, and distance measurement. Complemented by the lighting module and motorised z-height, measurements can also be extracted by the Smart Measurement feature, providing CMM-like capabilities.
(Group photo of ViTrox and MVTech teams proudly displaying the Global Technology Award 2023 trophy in front of the booth)
By integrating A.I. features in our V510i 3D AOI, users can automate programming and buy-off processes, reducing the need for skilled manual labour and minimising human error risks. Our AI-powered smart programming for AOI provides intelligent and automated programming to minimise human skills dependency and rapidly improve programming time by up to 4 times. In addition, we also offer another A.I. feature – A.I. Assisted Defect Review (also known as A.I. ViTrox Verification Tool Solution) where users can also automate buy-off processes in repair stations. This groundbreaking technology ensures a remarkable accuracy rate of over 90%, offering customers an unrivalled confidence level in the inspection results. On top of our AOI being IPC-CFX-2591 QPL validated, this solution is also SECS/GEM ready.
“With the release of this cutting-edge technology, I am confident that we will help the customer to address their pain points when adapting to Industry 4.0. This award comes as full amazement and honour to us. I would like to take this opportunity to demonstrate my greatest gratitude to the jury for selecting our V510i 3D AOI for Advanced Packaging for this prestigious award. The greatest honour goes to the team who never gives up on innovating the latest technology to bring greater value to fulfil customers' needs and meet their expectations,” said Mr Wee Kah Khim, CEO of Board Inspection and Embedded Solutions (BIE).
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Koh Young Discussing Ways to Apply Smart Factory Insights to Maximizing Productivity at SMTA Tijuana
10/14/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection solutions, will present at the SMTA Tijuana Expo & Tech Forum on November 13, 2025, at the Quartz Hotel in Tijuana, Baja California.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
10/03/2025 | I-Connect007I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.
Arc-Tronics Strengthens Inspection Capabilities with Three New Saki AOI Systems
09/26/2025 | Saki America,Saki America, Inc., an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce that Arc-Tronics, Inc., a high-reliability EMS provider based in Elk Grove Village, Illinois, has recently installed three 3Di-LS3 Series Automated Optical Inspection (AOI) systems in its production facility.