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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Statement of Support from IPC for New Actions to Strengthen America’s Supply Chains, Lower Costs for Families, and Secure Key Sectors
November 27, 2023 | IPCEstimated reading time: Less than a minute
Statement attributed to Chris Mitchell, IPC Vice President of Global Government Relations
IPC welcomes the actions outlined today by the U.S. Government “to strengthen supply chains critical to America’s economic and national security.”
The COVID-era disruptions experienced by the U.S. electronics manufacturing industry spotlight the extent to which the United States has outsourced its industrial base impacting everything from automobiles to aircraft to consumer products. The investments being made under the CHIPS and Science Act, Defense Production Act, and Inflation Reduction Act must cover more than just a few key products such as semiconductors – they also need to include the full electronics manufacturing system that enables semiconductor chips to function including printed circuit boards (PCBs) and integrated circuits (IC) substrates.
We are pleased to see today’s actions complementing last week’s announcement of a National Advancing Packaging Strategy. In addition, IPC welcomes the creation of a Cabinet-level Council on Supply Chain Resilience and a new quadrennial review process to ensure a comprehensive approach to this vital issue. We also applaud the actions to solidify the U.S. defense industrial base and the emphasis on international cooperation.
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