- Events||| MENU
Intel Granulate Optimizes Databricks Data Management OperationsNovember 27, 2023 | Intel
Estimated reading time: 1 minute
Intel® Granulate™, Intel’s flagship software performance offering, announced a new collaboration with Databricks to merge Intel Granulate’s autonomous, continuous optimization solutions with Databricks’ robust Data Intelligence Platform under the Databricks Partner Program. Designed to help customers derive greater scalability, this collaboration intends to enhance performance, reduce costs and increase efficiency across data management operations.
“The Databricks platform represents a significant leap toward the performant future of Spark SQL. When combined with the unique orchestration and tuning abilities that Intel Granulate provides for analytics workloads, the performance and cost benefits for data engineers grow significantly,” said Asaf Ezra, co-founder and general manager at Intel Granulate.
Seamlessly Reduce Big Data Costs
Capable of lowering cloud costs by 20% and reducing response times by an average of 35%, Intel Granulate stands at the forefront of autonomous, application-level performance enhancement, without requiring code changes or manual engineering effort. As a core product in Intel’s enterprise software portfolio, Intel Granulate consistently delivers visible results in as little as one to three weeks.
Databricks facilitates an open approach to data sharing, allowing teams to collaborate across platforms while securing and governing live datasets, models, dashboards and notebooks. The Databricks platform unifies data teams, streamlining data ingestion and management, and ensures that data lakes seamlessly manage all structured, semi-structured and unstructured data. It also forms the foundation of Databricks’ native machine learning capabilities.
Intel Granulate optimizes Databricks' data management operations without requiring code switches. (Credit: Intel Corporation)
Scalable Solutions for Modern Data Teams
Databricks’ platform becomes even more budget-friendly when paired with Intel Granulate’s runtime optimization and orchestration capabilities, making data management and engineering more efficient while simultaneously reducing response times and ensuring rapid, reliable and secure data applications for users.
Intel Granulate envisions a future where data management and sharing are not just open and collaborative, but also characterized by unmatched performance and cost efficiency. This collaboration signals a step toward making this vision a tangible reality, combining Intel Granulate’s autonomous optimization capabilities with the open data management facilitated by the Databricks platform.
The rapid advance of mobile technologies has sparked an insatiable demand for radio spectrum bandwidth. The rush to capitalize on wider bandwidths, higher data rates, and lower latency offered by frequency bands like 5G and millimeter wave is evident across industries. Cellular 5G and 6G networks, low-Earth orbit (LEO) and mid-Earth orbit (MEO) satellites, interconnected devices (IoT), autonomous vehicles, and even defense and environmental monitoring systems are driving this paradigm shift.
Open Platforming, AI and Strategic Collaboration Cement Schneider Electric’s Leadership in End-to-end Solutions for Grids of the Future02/27/2024 | Schneider Electric
Schneider Electric, the leader in the digital transformation of energy management and automation, today announced the latest innovations and progress towards accelerating grid modernization at DISTRIBUTECH International® 2024, the leading annual transmission and distribution event for utilities, technology providers, and industry leaders. Schneider has also affirmed their leadership in distributed energy resources management with its recognition by Guidehouse Insights as a leader in 2024 for both Grid DERMs and Grid Edge DERMS and #1 in 2023 for ADMS, reinforcing its strength with an industry-leading end-to-end portfolio and ecosystem for grid modernization.
IPC White Paper Emphasizes Critical Importance of Data Analytics for Electronics Manufacturing Process02/26/2024 | IPC
The increasing complexity of electronics manufacturing requires embracing data analytics to manage electronics factories, according to a new white paper from IPC’s Chief Technologist Council (CTC), "Outlook for Data Analytics in the Electronics Manufacturing Industry."
Over the past few months, we have met several of IPS's team members. IPS has been a manufacturer of wet process equipment for printed circuit board fabrication for over 30 years, working from its Cedar City, Utah, location. In part one of this interview, you will meet IPS team members Travis Houchin, Larry Boehm, and Kaal Glazier. With this group of two seasoned industry experts and the voice of the next generation, we cover several topics, including AI, and some useful tips when considering equipment, especially in brownfield sites.
Repair of soldered components is a constant necessity in the electronics industry. Product performance enhancement, damaged components, and exchange of wrong placed components are some of the motivations behind a repair. Dispensing and placing a 400 μm pitch component manually is very time consuming and could cause collateral damage to the already populated components. A novel automatic repair method and tools with no human interaction were developed. Learn about this method…