Happy’s Tech Talk #32: Three Simple Ways to Manage and Control Wet Processes
It’s Only Common Sense: Selling With Confidence
The New Chapter: The Impact of Parasitics on PCB DesignEMA Design Automation to Spin-Off IP & Services Group to Enable Digital Transformation for the Entire CAD Industry
December 4, 2023 | EMA Design AutomationEstimated reading time: 1 minute
EMA Design Automation, the world's premier EDA VAR, is spinning off their IP, content, and services group as a new company named Accelerated Designs, LLC with a focus on CAD agnostic solutions. Accelerated Designs will expand on the extensive design and methodology expertise EMA has gained implementing fully integrated CAD environments for customers globally
Accelerated Designs will provide design automation, system integration, and content services to the full ECAD and MCAD community, with a focus on CAD agnostic solutions that drive methodology, time-to-market, and efficiency improvements at all phases of design. The already CAD agnostic Ultra Librarian® brand will also become part of the Accelerated Designs portfolio.
“We are very excited to announce this new venture as it represents the culmination of the combined efforts of our highly dedicated team over many years,” said Manny Marcano, President and CEO of EMA Design Automation. “As we look to continue growing our IP and services business to support customers' multi-CAD environments, we see this as the best path to ensure we can fully serve the entire EDA community.”
As companies look to improve efficiency, leverage digital twins, and reduce overall schedule risk it is imperative that the methodologies and data used can be connected and leveraged at all phases. Accelerated Designs will help companies streamline their processes, reduce manual effort, and connect their data, all while allowing them to surface real-time information in context for optimal decision-making.
As part of the spin-off, EMA will enter into a distribution agreement with Accelerated Designs to enable EMA and their global partner network to continue providing these valuable IP and engineering services directly to customers.
Share on:
Suggested Items
Keys to Successful ECAD-MCAD Collaboration
08/08/2024 | Stephen V. Chavez, Siemens EDAAs PCB designs grow in scope and complexity, collaboration between the electronics and mechanical domains is a necessity. At the same time, smaller IC packages and more tightly packed PCBs compel electronics system development companies to think more about the mechanical form factor of items and recognize the importance of collaboration between MCAD and ECAD.
August Design007 Magazine: PCB Design Cost Drivers
08/08/2024 | I-Connect007 Editorial TeamIn this month’s issue of Design007 Magazine, our expert contributors explain the impact of cost drivers on PCB designs and the need to consider a design budget. They discuss the myriad design cycle cost adders—hidden and not so hidden—and ways to add value.
Tom Edman Leads IPC Board of Directors
07/17/2024 | Marcy LaRont, PCB007 MagazineIPC elected several new board members at IPC APEX EXPO in April, including new Board Chair Tom Edman, CEO of TTM, who assumes the role from Bob Neves, CTO and chair of Microtek Laboratories. Tom and TTM have long been active in many facets of IPC. I caught up with Tom and asked him about his new board appointment, IPC, and the industry he serves. He emphasizes IPC’s work in standards and advocacy as especially important for our industry.
Würth Elektronik Expands Optocoupler Series with Opto-TRIACs
07/04/2024 | Wurth ElektronikWürth Elektronik now offers a solution for phase control of AC loads, the new WL-OCTR optocouplers, a safe alternative to mechanical relays.
Siemens Debuts Fast, Accurate and Context-aware Electrostatic Discharge Verification Solution Spanning all Phases of IC Design
06/26/2024 | SiemensSiemens Digital Industries Software announced today a fully automated solution to help integrated circuit (IC) design teams rapidly identify and address Electrostatic Discharge (ESD) issues driven by the growing complexity of today’s next-generation IC designs, regardless of targeted process technology.