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Argonne to Lead Two Microelectronics Research Projects Under U.S. Department of Energy Initiative

01/13/2025 | BUSINESS WIRE
The U.S. Department of Energy’s (DOE) Argonne National Laboratory is managing two microelectronics studies that will support multidisciplinary codesign of hardware and software and enable processing of vast quantities of data at unprecedented speeds.

HaiLa Technologies Releases Extreme Low-Power Development Platform for Wi-Fi Communications

01/06/2025 | BUSINESS WIRE
HaiLa Technologies, a supplier of advanced low power wireless semiconductor solutions, introduced a new development platform to better support developers and researchers in creating extremely low power connected solutions.

NEOTech Significantly Improves Wire Bond Pull Test Process

11/25/2024 | NEOTech
NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.

Keysight Providing Software to Enable Researchers through the Microelectronics Commons

11/15/2024 | Keysight Technologies
Keysight Technologies, Inc. announced it has reached an agreement to provide its electronic design automation (EDA) software to six of the eight hubs participating in the Microelectronics Commons (Commons).

An Update on USPAE's Strategic Initiatives

11/12/2024 | Marcy LaRont, I-Connect007
James Will became executive director of the U.S. Partnership for Assured Electronics (USPAE) in May and now provides this update on the group's strategic initiatives. The organization, which is affiliated with IPC, recently transitioned to being a 501(c)(3). It is navigating through a dynamic landscape, working to enhance our microelectronics manufacturing capabilities including PCBs, and adapt to emerging technology trends and market challenges.
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