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Advanced Electronics Packaging Digest

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Microelectronics Network Launches Semiconductor Workforce Advisory Committee

09/15/2026 | SEMI
The National Network for Microelectronics Education (NNME) announced the formation of its inaugural Industry Advisory Committee, bringing together senior leaders from the semiconductor industry, universities, and community colleges to help guide the network's national workforce strategy and strengthen the talent pipeline supporting America's growing microelectronics ecosystem.

Mycronic Appoints Nomination Committee

09/15/2026 | Mycronic
The Nomination Committee for Mycronic’s 2027 Annual General Meeting has been appointed in accordance with the instructions for the Nomination Committee as decided by the 2026 Annual General Meeting.

Taiwan's PCB Industry Balances AI Opportunities with Risk Management

06/01/2026 | TPCA
To address the multiple risks arising from the intertwining of geopolitics, sustainable transformation, and the AI wave, the Taiwan Printed Circuit Association (TPCA) established the Sustainability and Risk Governance Committee.

PHOTO GALLERY: Putting in the Work on Standards, Professional Development

04/16/2026 | I-Connect007
Behind every standard, innovation, and step forward in electronics are the people who show up to do the work. This week's photo gallery highlights the attendees who filled meeting rooms and classrooms throughout APEX, collaborating on standards development committees, sharing expertise, and investing in their own growth through professional development. These are the faces of progress, gathered not just to learn, but to contribute and shape what comes next.

IPC-7712 Development Advances at APEX EXPO: Committee Aligns on Scope, Structure, and Industry Priorities

04/10/2026 | Circuit Technology Center, Inc.
Significant progress was made in developing the proposed standard IPC-7712, Component Safe Removal for Failure Analysis and Reclamation, during in-person meetings held at APEX EXPO, March 16 to 18.
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