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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

11/13/2026 | Nolan Johnson, I-Connect007
My must-reads this week are dominated by supply chain news, especially earlier this week. Topping the list is the Panasonic Taiwan factory fire, which we can expect to disrupt the laminate supply chain. In contrast and coincidentally, Ventec and MICAM announced plans to ramp up laminate production in Ireland. Qnity released a companion guide to its “On the Line With…” podcast series, and the topic is, naturally, advanced materials. We take one step out of supply chain to bring you Chris Mitchell’s column on what to expect in U.S. trade policy now that the midterm elections have set the stage for the next two years, and we wrap up by welcoming I-Connect007’s latest columnist, Dow’s Dr. Cody Schoener, writing on mil/aero and space resilience.

Global Electronics Association, Catena-X Partner to Advance Data Exchange Across the Electronics Industry

11/12/2026 | Global Electronics Association
The Global Electronics Association and Catena-X Automotive Network e.V. have signed a Memorandum of Understanding (MoU) to accelerate the adoption of trusted, standardized, and interoperable data exchange across the global electronics supply chain.

Arrow Electronics Launches New Business Capstone to increase Focus on IP&E Solutions

11/10/2026 | BUSINESS WIRE
Arrow Electronics, Inc. announced the launch of Capstone, a global business dedicated to interconnect, passive and electromechanical (IP&E) products, solutions and services.

Londian Wason, NAIKAN to Build Copper Foil Plant in Kazakhstan

11/09/2026 | ACN Newswire
According to Official Information Source of the Prime minister of the Republic of Kazakhstan, on 5 November 2026, Londian Wason New Energy Tech Inc. and NAIKAN Ltd. held a cooperation agreement signing ceremony in Astana.

Benchmark Expands U.S. Manufacturing for Oxide Computer Company

11/03/2026 | BUSINESS WIRE
Benchmark Electronics, Inc., a global provider of engineering, design, and manufacturing services, announced expanded U.S. production for Oxide Computer Company, the on-premises cloud computing company and creator of the Oxide Cloud Computer.
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