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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Schneider Electric Launches Uniflair XCA Chiller Line for High-Density AI Data Centers

06/09/2026 | Schneider Electric
Schneider Electric, a global energy technology leader, announced the launch of Uniflair XCA, a new series of air-cooled and free-cooling chillers designed to meet the rapidly evolving demands of AI-driven, high-density liquid-cooled data centers.

My Trip to Schneider Electric: AI, Data, and the Need for More Power

06/02/2026 | Marcy LaRont, I-Connect007
AI is pushing power infrastructure to its limits, and many of those same challenges, particularly around power delivery and heat management, parallel what the electronics industry faces in building and scaling advanced microelectronics. Yet when it comes to AI and hardware, we typically only see a small piece of the total picture. So, when Schneider Electric invited me to tour a modern AI data center still under construction, I jumped at the opportunity. This became a fascinating technical journey I’m excited to share.

Schneider Electric Progresses Phased-Delivery of Over $290M in AI Infrastructure Solutions, Including Motivair Technologies, at Terawulf’s Google-Backed Lake Mariner Campus

06/02/2026 | Schneider Electric
Schneider Electric, a global energy technology leader and Motivair by Schneider Electric , a leading innovator in liquid cooling technology for digital infrastructure, today announced the successful phased-delivery of more than $290M in AI infrastructure solutions for TeraWulf’s rapidly expanding Lake Mariner data campus. 

Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging

04/20/2026 | Marcy LaRont, I-Connect007
The second presentation in a recent Global Electronics Association’s Executive Pulse webinar series widened the lens on advanced packaging, moving beyond the component level to a systems-level view of how AI is reshaping the electronics landscape. Building on Dr. Hemanth Dhavaleswarupu of AMD’s previous discussion of chip-level packaging innovation, Dr. Jung Yoon of IBM explored the broader infrastructure implications, from the data center floor to the global supply chain.

MHI Unveils 'DIAVAULT,' a Secure, High Performance Edge Data Center Platform

02/25/2026 | JCN Newswire
Mitsubishi Heavy Industries, Ltd. (MHI) announced the launch of DIAVAULT, a newly developed industrial grade edge data center brand.
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