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Ansys’ Collaboration with Schrödinger will Accelerate Materials Development with Unprecedented Multiscale Simulation

05/09/2024 | ANSYS
Ansys and Schrödinger are collaborating to deliver an ICME approach that bridges the gap between materials discovery and product development.

IDC Forecasts Slower Growth for Global Telecommunications Services Market: Could AI Help Telcos to Maintain Healthy Margins?

05/08/2024 | IDC
Worldwide spending on Telecom Services and Pay TV Services reached $1,509 billion in 2023, an increase of 2.1% over 2022, according to the International Data Corporation (IDC) Worldwide Semiannual Telecom Services Tracker.

Key Tronic Announces Results for Q3 of Fiscal Year 2024

05/08/2024 | Globe Newswire
For the third quarter of fiscal year 2024, Key Tronic reported total revenue of $140.5 million, compared to $164.6 million in the same period of fiscal year 2023.

Indium Corporation to Showcase HIA Materials at ECTC

05/07/2024 | Indium Corporation
As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.

Real Time with…. IPC APEX EXPO 2024: Innovation and Collaboration at EPTAC

05/06/2024 | Real Time with...IPC APEX EXPO
Guest Editor Kelly Dack and EPTAC Vice President Leo Lambert discuss the partnership between EPTAC and Blackfox, their program alignment, and future expansion plans. Leo introduces Burak Gokmen as the new "leader of the pack." The focus then shifts to Nano Dimensions' 3D printed circuit boards, emphasizing the need for proper documentation and training.
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