Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/11/2025 | Andy Shaughnessy, Design007 Magazine
This week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Digital Twin Concept in Copper Electroplating Process Performance

07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.
PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.

Trump Copper Tariffs Spark Concern

07/10/2025 | I-Connect007 Editorial Team
President Donald Trump stated on July 8 that he plans to impose a 50% tariff on copper imports, sparking concern in a global industry whose output is critical to electric vehicles, military hardware, semiconductors, and a wide range of consumer goods. According to Yahoo Finance, copper futures climbed over 2% following tariff confirmation.

PwC: One Third of Chip Production Could Face Copper Supply Disruptions by 2035

07/09/2025 | I-Connect007 Editorial Team
A July 8 report by PricewaterhouseCoopers (PwC) revealed that 32% of global semiconductor production could face climate change-related copper supply disruptions by 2035, according to Reuters.

Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids

07/09/2025 | Happy Holden -- Column: Happy’s Tech Talk
When we consider via reliability, the major contributing factors are typically processing deviations. These can be subtle and not always visible. One particularly insightful column was by Mike Carano, “Causes of Plating Voids, Pre-electroless Copper,” where he outlined some of the possible causes of hole defects for both plated through-hole (PTH) and blind vias.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in