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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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onsemi, Geely Expand Strategic Collaboration to Elevate the Driving Experience

05/01/2026 | onsemi
onsemi and Geely Auto Group today announced an expanded global strategic collaboration aimed at accelerating the development of next-generation electric and hybrid vehicles.

DENSO Invests in Next Core Technologies to Enhance Performance of Electric Vehicles

03/20/2026 | JCN Newswire
DENSO CORPORATION announced it has invested in Next Core Technologies, Inc. with the aim of jointly developing in the field of motor cores.

Qualcomm, Wayve Advance Production-Ready End-to-End AI for ADAS and Automated Driving

03/13/2026 | Qualcomm Technologies, Inc.
Qualcomm Technologies, Inc. and Wayve today announced a technical collaboration that expands automaker choice with an advanced production‑ready ADAS and AD system for automakers worldwide.

Elektrobit, Mobileye Announce Collaboration for Autonomous Vehicle Solutions

02/27/2026 | Elektrobit
Elektrobit and Mobileye announced the integration of EB corbos Linux for Safety Applications into Mobileye Drive, a scalable end-to-end Level 4 self-driving system.

Infineon Technologies, BMW Group Partner on Software-Defined Vehicles for Neue Klasse

02/17/2026 | Infinite Electronics
Infineon Technologies AG plays an important role in shaping the software-defined vehicle architecture of BMW Group’s Neue Klasse, a platform that redefines individual mobility by combining electrification, digitalization, and sustainability.
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