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Advanced Electronics Packaging Digest

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Suggested Items

Fuji Launches the Auto Kitting Station

06/12/2026 | Fuji Corporation
Fuji Corporation has developed a new unit, the Auto Kitting Station, which automates the tape reel loading process (kitting process) for feeders used to supply electronic components to machines; a process that has traditionally been difficult to automate and heavily dependent on manual labor.

Atomera Breakthrough Targets Broader RF Adoption of GaN-on-Silicon

06/05/2026 | BUSINESS WIRE
Atomera Incorporated, a semiconductor materials and technology licensing company, announced a new approach to GaN-on-Silicon that addresses a key performance barrier limiting its use in mainstream RF applications.

Compal Builds Biotech AI Platform with Quantum Tech and University-Pharma Partnerships

06/04/2026 | Compal Electronics Inc.
Compal Electronics showcases its landmark achievements in Quantum Technology and Advanced Artificial Intelligence (AI) at COMPUTEX 2026.

BAE Systems Bofors Completes Aston Harald Acquisition

05/24/2026 | BAE Systems
In February 2026, BAE Systems Bofors signed a purchase agreement to acquire Aston Harald Mekaniska Verkstad AB – a Swedish supplier of precision mechanics and advanced component machining for products within the defence and aerospace sectors, as well as the commercial market.

Lightium Selects Aras Innovator to Support Development of Photonic AI Chips

05/12/2026 | BUSINESS WIRE
Aras, a leading provider of digital thread solutions for product lifecycle management (PLM) and engineering AI, announced that Lightium, a Switzerland-based startup specializing in photonic integrated circuits (PICs), has selected Aras Innovator® to establish a connected foundation for managing the complexity of its photonic chip development.
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