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ispace-EUROPE, the Italian Space Agency (ASI) Sign Payload Services Agreement

12/30/2024 | BUSINESS WIRE
ispace EUROPE S.A., the Luxembourg-based subsidiary of ispace, inc., and the Italian Space Agency (ASI) have signed a payload services agreement to transport a Laser Retroreflector Array (LaRA2) to enable accurate position measurements on the Moon via laser ranging experiments, the two organizations announced today.

Beyond Design: AI-driven Inverse Stackup Optimization

12/26/2024 | Barry Olney -- Column: Beyond Design
Artificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.

MicroCare Welcomes Dagmara Charyk as Regulatory Affairs Manager

12/13/2024 | MicroCare Corp.
MicroCare, a leading provider of critical cleaning solutions, is excited to announce the appointment of Dagmara Charyk as the new Regulatory Affairs Manager. In this key role, Dagmara will oversee regulatory compliance, product registrations, and industry standards, further strengthening the MicroCare commitment to delivering safe and effective products to its customers.

Nano Dimension’s Additive Electronics Product Line - Essemtec - Received a Global Technology Award

12/11/2024 | Nano Dimension
Nano Dimension Ltd, a leading supplier of Additively Manufactured Electronics (AME) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (AM) 3D printing solutions, announced that its Tarantula Underfill system from its Essemtec product lines received the Global Technology Award for Innovation at the SMTA International 2024 Show in Chicago, Illinois.

Has the Time Finally Come for Tin-nickel Plating?

12/09/2024 | Marcy LaRont, PCB007 Magazine
In the 1980s, Electrochemicals, Inc. (now Electrochemical Products) made a significant shift from furniture and industrial goods to electronics and manufacturing. During this journey, a tin-nickel plating alloy was developed. In 1984, Mike Carano, a young engineer, published a paper on tin-nickel plating alloy, but after some initial attention, the plating solution fell into obscurity. Today, PCB fabrication looks largely the same, yet changes are afoot, chiefly due to the demands for very fine feature capability on printed circuit boards, as well as environmental sustainability. So, in this fascinating conversation with Mike Carano and Happy Holden, we take another look at tin-nickel and its advantages in both performance and sustainability.
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