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IPC Releases Latest List of Standards and Revisions

03/12/2025 | IPC
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.

TopLine Bringing Answers, New Ideas to APEX 2025

02/04/2025 | TopLine
TopLine® Corporation’s engineers will discuss groundbreaking technologies and product solutions at the upcoming IPC APEX EXPO 2025 this coming March 18-20 at the Anaheim Convention Center in California.

Altus Group Introduces Innovative BGA Reballing Solution to Meet Growing Sustainability Demands

09/25/2024 | Altus Group
Altus Group, a leading distributor of capital equipment in the UK and Ireland, has introduced an advanced BGA re-balling solution to address the electronics industry's growing focus on sustainability and cost-efficiency.

INSPECTIS’ Extended Reach BGA-XL Stand for Larger PCBAs Joins Higher Magnification XM Lenses

09/23/2024 | INSPECTIS
Ultra-low clearance BGAs on large PCBAs are no problem to optically inspect now, because INSPECTIS’ BGA-XL stand will reach them, while optional new XM lenses will get you under them – offering  up to 285x screen magnification.

Beyond Design: Integrated Circuit to PCB Integration

09/11/2024 | Barry Olney -- Column: Beyond Design
Technologies such as artificial intelligence, autonomous cars, smartphones, and wearable devices are significantly transforming the semiconductor industry. The miniaturization trend drives the IC footprint to an even smaller profile, requiring tighter margins. From the PCB designer’s perspective, smaller form factors are achievable, making devices more compact and lightweight. But double-sided SMT placement, reduced routing channels, and high-speed constraints create multiple challenges for designers. However, there are some advantages to miniaturization: shorter interconnects between the IC and the PCB reduce signal loss and electromagnetic interference. High-speed digital signals in the GHz range benefit from reduced parasitics.
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