Defense Speak Interpreted: The Autonomous Plane Battle—Skyborg Vs. Loyal Wingman
American Made Advocacy: Congress Back from Break With Work To Do
Beyond the Board: What Companies Need to Know Before Entering the MilAero PCB Market
IPC Releases Latest Standards and Revisions Updates
June 5, 2025 | IPCEstimated reading time: 1 minute
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q2 2025.
IPC-1602A
Standard for Printed Board Handling and Storage
The industry's sole standard on the handling, packaging, and storage of printed boards. The requirements in this document are intended to protect printed boards from contamination, physical damage, solderability degradation, ESD, and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling, and transport of product, as well as establishing baking profiles for moisture removal. This document addresses the impact of baking on printed board solderability, moisture concerns for etched cores and composites, dry packaging requirements including moisture barrier bags (MBBs), desiccant material and HIC cards, test coupons for evaluating relative moisture absorption and guidance for floor life and rework by baking.
IPC-7095E
Design and Assembly Process Guidance for Ball Grid Arrays (BGAs)
IPC-7095E describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair, and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095E provides valuable and practical information to those who use or are considering using BGAs. IPC-7095E provides descriptions of how to successfully implement robust design and assembly processes for printed board assemblies using BGAs, as well as ways to troubleshoot some common anomalies that can occur during BGA assembly.
IPC-8401
Guidelines for In-Mold Electronics
IPC-8401 provides guidelines for in-mold electronics (IME) manufacturing processes, part structures, candidate materials, and production test methods. In-mold electronics integrate printed electronics and electrical components into injection-molded plastics, creating a three-dimensional smart molded structure. IME technology uses mass production processes, materials, and components. IME parts are structural electronics characterized by their light weight, thinness, robustness, and seamless integration.
Get the rest of the updates in the Spring 2025 issue of IPC Community.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Zhen Ding Holding Posts September 2025 Monthly Revenue Report
10/10/2025 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported September 2025 revenue of NT$19,362 million, up 32.15% MoM and up 0.13% YoY, marking the second-highest level for the same period in company history.
Dymax's New 9773 Ruggedized Adhesive Meets NASA ASTM E595 Low Outgassing
10/07/2025 | DymaxDymax, a leading manufacturer of rapid and light-curing materials and equipment, is pleased to add 9773 ruggedizing and staking adhesive to its portfolio of materials designed for coating, protecting, and securing components on printed circuit boards in satellites, missiles, and space applications.
American Standard Circuits to Exhibit at SMTA International
10/06/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Circuits/ASC Sunstone Circuits has announced that his company will once again exhibit at SMTA International 2025 to be held at the Donald E Stephens Convention Center in Rosemont, Illinois on October 19th through the 23rd, 2025.
Capital Electro-Circuits Achieves ITAR Registration to Strengthen Aerospace and Defense Capabilities
10/06/2025 | Capital Electro-CircuitsCapital Electro-Circuits, Inc. (CEC), a U.S.-based manufacturer of mission-critical printed circuit boards since 1985, announced that it is now officially registered with the U.S. Department of State, Directorate of Defense Trade Controls (DDTC) under the International Traffic in Arms Regulations (ITAR).
Elephantech's SustainaCircuits FPC Adopted for Mass Production in OM Digital Solutions’ Interchangeable Lens
10/06/2025 | ElephantechElephantech Inc. is pleased to announce that its proprietary flexible printed circuits (FPCs) have been adopted for mass production by OM Digital Solutions Corporation in the company’s latest flagship products.