The Chemical Connection: Surface Finishes for PCBs
It’s Only Common Sense: 7 Tips to Focus on What Works
The Marketing Minute: Go Big or Go Home—Long-form Content Is Your Brand’s Best Friend
SIA Applauds Announcement of New CHIPS Incentives
January 4, 2024 | SIAEstimated reading time: 1 minute
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer in response to the semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Microchip Technology. The incentives, which are part of the CHIPS and Science Act, will support Microchip’s manufacturing projects in Colorado and Oregon.
“Today’s announcement will help propel semiconductor manufacturing projects in Colorado and Oregon and reinforce America’s chip supply chains for critical automotive, medical, aerospace, and defense technologies, among other applications. We congratulate Microchip on advancing these important projects and commend the progress made by Secretary Raimondo and the CHIPS Program Office team in beginning to distribute CHIPS incentives. We look forward to seeing more projects receive vital CHIPS funding to help reinvigorate America’s economy, national security, and critical supply chains.”
The CHIPS Act’s manufacturing incentives have already sparked substantial investments in the U.S. In fact, companies in the semiconductor ecosystem have announced dozens of new projects across America—totaling more than $200 billion in private investments—since the CHIPS Act was introduced. These announced projects will create more than 40,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout the U.S. economy.
Share on:
Suggested Items
Ansys Semiconductor Solutions Certified by TSMC for Reliable, Accurate Analysis of Evolving Chip Designs
04/03/2025 | PRNewswireAnsys announced that PathFinder-SC is certified as a new ESD analysis solution for customers designing with TSMC's N2 silicon process technology. PathFinder-SC delivers a novel verification solution that provides superior capacity and performance, easily accommodating large designs in the cloud.
SEMI, ESIA Rally Political Support for a European Semiconductor Strategy
03/20/2025 | SEMISeeking to explore semiconductor policy measures that can strengthen the industrial policy in the European Union, SEMI and the European Semiconductor Industry Association (ESIA) have successfully held a high-level roundtable event in the European Parliament under the auspices of Members of the European Parliament (MEPs) Bart Groothuis (Renew Europe), Oliver Schenk (European People’s Party) and Dan Nica (Socialists and Democrats Party).
Defense Speak Interpreted: It’s Time for a ‘Defense-Speak’ Update
03/18/2025 | Dennis Fritz -- Column: Defense Speak InterpretedI’m Denny Fritz, the author of 30 “Defense Speak Interpreted” columns from 2018 to 2022. My original concept for this monthly op-ed was to explain the unique acronym language used by the U.S. Defense Department: CMMC, DIUx, C4ISR, JEDI, etc. When I started consulting for NSWV Crane almost 20 years ago, I would find myself sitting in meetings, perplexed at what I heard. Half the conversations were using acronyms that were foreign to me.
YINCAE: UF 158UL Redefines Underfill for Large Chips
03/12/2025 | YINCAEYINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips, offering unparalleled performance in room temperature flow, fast cure, and high reliability.
TASMIT Launches Large Glass Substrate Inspection System for Advanced Semiconductor Packaging
03/04/2025 | ACCESSWIRETASMIT Inc. has launched a new inspection system for glass substrates as part of its INSPECTRA® series of semiconductor wafer visual inspection systems, which has gained attention for its high efficiency in advanced semiconductor manufacturing.