Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Siemens, Sony Deliver Breakthrough Immersive Engineering for the Industrial Metaverse

01/09/2025 | Siemens Digital Industries
Siemens Digital Industries Software, in collaboration with Sony Corporation, announced today that it is delivering on its next-generation immersive engineering roadmap that brings together Siemens’ NX software for product engineering with Sony’s breakthrough head-mounted display (HMD) to enable the industrial metaverse.

Siemens Launches New Program to Empower Startups with Cutting-edge Technology

01/07/2025 | Siemens
Siemens launched Siemens for Startups, a new program to empower early-stage engineering and manufacturing startups.

Siemens Extends Veloce Hardware-assisted Verification Support of EPGM Ethernet to 1.6 Tbps

12/18/2024 | Siemens
Siemens Digital Industries Software announced today an extension of its Veloce™ hardware-assisted verification platform to support 1.6 Tbps Ethernet. As a core component of the Siemens software/hardware and system validation platform, Veloce delivers complete virtual models to support Ethernet Packet Generator and Monitor (EPGM) Ethernet port speeds up to 1.6 Tbps.

Siemens’ Solido SPICE Now Certified for Multiple Leading-edge Samsung Foundry Processes

11/27/2024 | Siemens Digital Industries Software
Siemens Digital Industries Software announced that its continued collaboration with longtime customer Samsung Foundry has established a host of new certifications for its recently introduced Solido™ SPICE software, which supports the verification of next-generation analog, mixed-signal, RF, memory, library IP and 3D-IC semiconductor designs. 

Sat Nusapersada Chooses Siemens' Process Preparation Software to Boost NPI and SMT Line Efficiency

11/21/2024 | Siemens Digital Industries Software
Siemens Digital Industries Software announced that Sat Nusapersada, one of the largest Electronics Manufacturing Services (EMS) providers in Indonesia, has adopted its Process Preparation software to reduce its timescale for New Product Introduction (NPI) of printed circuit board assemblies and improve the efficiency of its Surface Mount Technology production lines by 23 percent.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in