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ASMPT: Innovative Bonding for Power Electronics

12/09/2024 | ASMPT
ASMPT presents with its SilverSAM™ SilverSAM machine a highlight for makers of modern power electronics: an innovative and versatile silver sintering machine that meets the great demands on bonding, which is particularly critical in the field of electromobility. SilverSAM sets new standards in interconnect technology for power electronics, particularly in the rapidly growing electric vehicle market.

Understanding Depreciation for Electronic Manufacturers

12/04/2024 | Doug Palladino, ASC Sunstone Circuits
As a PCB design engineer, your focus is on creating innovative, cost-effective designs. However, the financial aspects behind your designs—such as depreciation—play a significant role in the overall business. While depreciation may sound like "accounting speak," understanding it can help you make better decisions for your projects, especially when dealing with equipment, machinery, or even intangible assets like software licenses.

VDMA Machine Vision Elects New Board; Appoints Olaf Munkelt as Chairman

11/26/2024 | VDMA
Within the context of the members' assembly of the VDMA Robotics + Automation Association, the members of the VDMA Machine Vision division elected a new Board. Olaf Munkelt, Co-founder and Managing Director of MVTec Software GmbH, was subsequently appointed Chairman by the newly elected VDMA Machine Vision Board.

ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production

11/20/2024 | ASMPT
The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.

Yamaha Robotics Brings Inspection Innovations for Growing Markets to electronica 2024

11/19/2024 | Yamaha Robotics SMT Section
Yamaha Robotics SMT section presented innovations in high-speed surface-mount inspection at electronica 2024, demonstrating the latest AI skills and special features for applications including LED lighting, e-mobility, and mechatronics.
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