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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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PCB007 Magazine January 2024 Issue Released
January 18, 2024 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Getting to Know Your Designer
How well do you really know your designers? What makes for a closer, more synchronized working relationship? After all, as a fabricator, you’re manufacturing what is often the only custom part on the entire electronics subassembly. Earlier this month, we published an issue of Design007 Magazine that helps designers better understand how to work with you, the fabricator. So, what’s key to improving your understanding of how your customer ticks?
In the January 2024 issue of PCB007 Magazine, we investigate how to build a good relationship with designers. Dana Korf, an I-Connect007 columnist, contributed a feature article this month titled “The Designer and Manufacturer Must Be in Sync”; NCAB’s field application engineers explore how to foster loyal customer/vendor relationships; Don Ball of Chemcut uses his column space to talk about the ins and outs of getting to know your vendor; and IPC design instructor (and the most recent addition to the IPC Education Department) Kris Moyer shares his take as a designer with respect to what fabs should be communicating.
We also bring you an interview with Summit Interconnect COO Sean Patterson, who came to the industry from Amazon and talks about culture shift and operational efficiencies.
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Rachael Temple - AlltematedSuggested Items
It’s Only Common Sense: Customers Capabilities—and Confidence
04/20/2026 | Dan Beaulieu -- Column: It's Only Common SenseI’ve been around, man! I’ve been in enough conference rooms, factory floors, and late-night airport lounges to know one thing for certain: Most companies think they lose business because they lack capability. They don’t. They lose business because they fail to inspire confidence.
AGC's Advanced PCB Material Solutions
04/17/2026 | Real Time with... APEX EXPOAGC's line includes advanced PCB materials for critical industries such as aerospace, defense, and medical. This interview highlights their commitment to North American sourcing, offering solutions to today's challenges. AGC provides specialized automotive PCB materials including fastRise, a low-loss non-reinforced prepreg designed for high-frequency applications like 77 GHz radar.
A 60-Year Legacy of PCB Innovation from IEC
04/17/2026 | Real Time with... APEX EXPOChris Hrusovsky, director of business development for International Electronic Components (IEC), shares his company’s commitment to customer partnerships, seamless service, and technical support for fabricators. Chris updates us on technological advancements in direct imaging, copper-filled vias, and the company's global collaborations driving innovation in consumables and equipment.
Indium Faces Complex Soldering Head On
04/17/2026 | Real Time with... APEX EXPOKevin Brennan of Indium Corporation discusses the complexities of soldering diverse component sizes on high-performance computing boards. He introduces DuraFuse LT solder paste, a novel solution designed to address challenges like uneven heating and warpage during reflow. This innovative alloy enables a wider operational window, reducing peak temperatures and enhancing product reliability without requiring board redesign.
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.