Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Qnity Launches Optivision Max CMP Pad Family for Next-Gen Semiconductor Manufacturing

06/10/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced the expansion of its offerings for chemical mechanical planarization (CMP) with the introduction of Optivision™ Max polishing pads.

Mobix Labs to Acquire U.S.-Built Drone Manufacturer Vision Aerial

06/05/2026 | BUSINESS WIRE
Mobix Labs, Inc. announced that it has signed a binding Letter of Intent to acquire Vision Aerial, Inc., a Montana-based manufacturer of American-built drones trusted in national security, government, energy, public safety, and critical infrastructure operations.

DIMAAG Acquires Akridata to Scale Physical AI and Next-Generation Infrastructure

05/28/2026 | BUSINESS WIRE
DIMAAG, a deep technology company building industrial AI, energy systems, and high-performance infrastructure for hyperscale AI data centers, announced the acquisition of Akridata, a company specializing in AI vision systems and edge-to-core AI infrastructure.

Renesas Completes Acquisition of Irida Labs

05/07/2026 | Renesas
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that a subsidiary of Renesas has completed the acquisition of Irida Labs, a Greece-based company specializing in embedded software for AI-powered visual perception systems.

STMicroelectronics Enables Always-On Vision with Ultralow-Power Image Sensors

05/01/2026 | STMicroelectronics
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, introduces a new generation of ultralow-power global-shutter image sensors that deliver high-quality, always-on vision to compact devices operating on batteries or harvested energy.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in