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Advanced Electronics Packaging Digest

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TSMC and Amkor Technology Announce Long Term Partnership to Accelerate Advanced Packaging in the US

06/16/2026 | BUSINESS WIRE
Taiwan Semiconductor Manufacturing Company and Amkor Technology, Inc. announced a 10-year agreement to foster a strong partnership that will enhance advanced semiconductor packaging capabilities in Arizona, strengthening and accelerating investment in the U.S. semiconductor supply chain ecosystem.

Amkor Technology Announces Q4 and Full-Year 2025 Financial Results

02/13/2026 | Amkor Technology
Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced financial results for the fourth quarter and full year ended December 31, 2025.

Amkor Technology Breaks Ground on New Semiconductor Advanced Packaging and Test Campus in Arizona

10/08/2025 | Amkor Technology
Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, announces the groundbreaking and expanded planned investment of its new state-of-the-art outsourced semiconductor advanced packaging and test campus in Arizona.

Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility

09/01/2025 | BUSINESS WIRE
Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced revised plans for the location of the company’s new semiconductor advanced packaging and test facility in Arizona.

Amkor Technology Issues Statement Regarding City of Peoria Land Acquisition

08/28/2025 | Amkor Technology
Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, today announced the City of Peoria, Arizona successfully bid as part of a State Land Auction to acquire 834.5 acres for future development.
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