Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility

09/01/2025 | BUSINESS WIRE
Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced revised plans for the location of the company’s new semiconductor advanced packaging and test facility in Arizona.

Amkor Technology Issues Statement Regarding City of Peoria Land Acquisition

08/28/2025 | Amkor Technology
Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, today announced the City of Peoria, Arizona successfully bid as part of a State Land Auction to acquire 834.5 acres for future development.

Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.

12/25/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology, Inc., up to $407 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

Amkor, TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona

10/08/2024 | TSMC
Amkor Technology, Inc. and TSMC announced that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem.

Amkor Signs Preliminary Memorandum of Terms with US Department of Commerce for Arizona Advanced Packaging and Test Facility

07/29/2024 | Amkor Technology
Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced it has signed a non-binding preliminary memorandum of terms with the US Department of Commerce to receive proposed funding as part of the CHIPS and Science Act.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in