Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.

12/25/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology, Inc., up to $407 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

Amkor, TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona

10/08/2024 | TSMC
Amkor Technology, Inc. and TSMC announced that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem.

Amkor Signs Preliminary Memorandum of Terms with US Department of Commerce for Arizona Advanced Packaging and Test Facility

07/29/2024 | Amkor Technology
Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced it has signed a non-binding preliminary memorandum of terms with the US Department of Commerce to receive proposed funding as part of the CHIPS and Science Act.

Infineon, Amkor Sign Memorandum of Understanding to Stimulate Sustainable Action Across the Supply Chain

07/22/2024 | Infineon
Infineon Technologies AG, a leader in power systems and IoT, has signed a Memorandum of Understanding with Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, with a joint commitment to stimulate decarbonization and sustainability strategies across the supply chain.

Infineon, Amkor Deepen Partnership and Strengthen European Supply Chain for Semiconductor Solutions

04/10/2024 | Infineon
Infineon Technologies AG, a leader in power systems and IoT, is strengthening its outsourced backend manufacturing footprint in Europe and announced a multi-year partnership with Amkor Technology, Inc., a leading provider of semiconductor packaging and test services.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in