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Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility
September 1, 2025 | BUSINESS WIREEstimated reading time: 1 minute
Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced revised plans for the location of the company’s new semiconductor advanced packaging and test facility in Arizona.
The facility will be constructed on a 104-acre site within the Peoria Innovation Core, in north Peoria, AZ. Peoria City Council unanimously approved a land swap and an amended development agreement, allowing Amkor to exchange its previously designated 56-acre parcel within the Five North at Vistancia community. Construction of the facility will begin within days, with production expected to start in early 2028.
“As the largest advanced packaging company in the U.S., Amkor is proud to invest in U.S. semiconductor manufacturing and strengthen the U.S. semiconductor supply chain,” said Giel Rutten, Amkor’s president and chief executive officer. “This new site offers the flexibility to meet growing customer demand and reinforces our commitment to U.S.-based chip manufacturing.”
“Today represents a historic milestone for the partnership between the City of Peoria and Amkor,” said Peoria Mayor Jason Beck. “By securing this land, we are not only bringing a $2 billion investment and 2,000 new jobs to our community, but we are further solidifying the important role Peoria will play in strengthening America’s critical semiconductor supply chain. This outcome demonstrates the power of strong partnerships and smart long-term planning."
Amkor has operated in Greater Phoenix since 1984. As part of Arizona's growing semiconductor ecosystem, Amkor will work with TSMC and other key semiconductor companies to provide advanced, high-volume manufacturing for industries such as computing, communications, and automotive.
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