Power Management IC Market Size Worth USD 147.87 Billion in 2032
January 26, 2024 | Globe NewswireEstimated reading time: Less than a minute
The global power management Integrated Circuit (IC) market size was USD 33.20 Billion in 2022 and is expected to register a revenue CAGR of 16.2% during the forecast period. Rapid technological advancements in power management is creating a high demand for battery-operated devices, increasing sales of consumer electronics and miniaturization of electrical component, and rapid growth in automotive and transportation industry are some factors expected to drive the power management IC market revenue growth over the forecast period.
Increasing sales of consumer electronics and miniaturization of electrical components are other factors driving revenue growth of the power management IC market. Energy-efficient, high-power-density and lower standby-power design options are made possible by power management ICs. These integrated solutions speed up time to market by shortening the design cycle and enabling quick selection and simulation of ideal configurations for power management design.
Suggested Items
Maxar Awarded Contract by NGA to Deliver Ai-Powered Object Detection Services
07/01/2025 | MaxarMaxar Intelligence, the leading provider of secure, precise geospatial insights, announced that it was awarded Delivery Order 01 under the Luno A program by the National Geospatial-Intelligence Agency (NGA).
Empower Appoints Steve Hertog as Senior Vice President of Sales to Strengthen Next Phase of High Growth
07/01/2025 | Empower SemiconductorEmpower Semiconductor, the world leader in integrated voltage regulators (IVRs), announced the appointment of Steve Hertog as Senior Vice President of Sales. In this role,
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.
Cadence AI Autorouter May Transform the Landscape
06/19/2025 | Andy Shaughnessy, Design007 MagazinePatrick Davis, product management director with Cadence Design Systems, discusses advancements in autorouting technology, including AI. He emphasizes a holistic approach that enhances placement and power distribution before routing. He points out that younger engineers seem more likely to embrace autorouting, while the veteran designers are still wary of giving up too much control. Will AI help autorouters finally gain industry-wide acceptance?
Nordic Semiconductor Accelerates Edge AI Leadership with Acquisition of Neuton.AI
06/18/2025 | PRNewswireNordic Semiconductor, the global leader in ultra-low-power wireless connectivity solutions, today announced its acquisition of the intellectual property and core technology assets of Neuton.AI, a pioneer in fully automated TinyML solutions for edge devices.