After Three Years on Mars, NASA’s Ingenuity Helicopter Mission Ends
January 26, 2024 | NASAEstimated reading time: 1 minute
After its 72nd flight on Jan. 18, 2024, NASA's Ingenuity Mars Helicopter captured this color image showing the shadow of a rotor blade damaged during a rough landing. NASA’s history-making Ingenuity Mars Helicopter has ended its mission at the Red Planet after surpassing expectations and making dozens more flights than planned. While the helicopter remains upright and in communication with ground controllers, imagery of its Jan. 18 flight sent to Earth this week indicates one or more of its rotor blades sustained damage during landing and it is no longer capable of flight.
Originally designed as a technology demonstration to perform up to five experimental test flights over 30 days, the first aircraft on another world operated from the Martian surface for almost three years, performed 72 flights, and flew more than 14 times farther than planned while logging more than two hours of total flight time.
“The historic journey of Ingenuity, the first aircraft on another planet, has come to end,” said NASA Administrator Bill Nelson. “That remarkable helicopter flew higher and farther than we ever imagined and helped NASA do what we do best – make the impossible, possible. Through missions like Ingenuity, NASA is paving the way for future flight in our solar system and smarter, safer human exploration to Mars and beyond.”
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Flexible Thinking: Designing Flex Circuits for Dynamic Reliability
04/09/2026 | Joe Fjelstad -- Column: Flexible ThinkingFlex circuits flex. No surprises there. However, they are also very commonly designed into products because they are thin and offer consistent thickness and dielectric properties, attributes highly prized by present-day product designers of personal electronics. This would include smartphones and, increasingly, wearable electronics for medical monitoring and even fashion.
My Top 7 Takeaways from APEX EXPO 2026
04/03/2026 | Chris Mitchell, VP of Global Government Relations, Global Electronics AssociationI’m back from APEX EXPO 2026 in Anaheim, California, and it was another great year. Even amid significant global volatility, the industry is growing, innovating, and building partnerships. As I reflect on the experience, I want to share my top 7 takeaways and explain why each matters. First is this year’s Advanced Electronics Packaging Conference (AEPC) , which delivered outstanding, peer-reviewed content and strong participation, reflecting how central advanced electronics packaging has become across the industry.
APEX EXPO Opens Today With Ribbon Cutting and Sold-Out Show Floor
03/17/2026 | Michelle Te, I-Connect007APEX EXPO officially opens today with a ribbon-cutting ceremony welcoming attendees onto the sold-out show floor in Anaheim, California. Standards committee meetings and professional development courses have been underway since the weekend, but Tuesday marks the official opening of the exhibition as more than 400 exhibitors prepare to showcase their latest equipment, materials, and technologies across 140,000 square feet of exhibit space.
Finding Your Marketing Niche in a Crowded PCB Industry
03/10/2026 | Richard Nichols, GreenSource EngineeringI recently made a flippant comment on LinkedIn, “All marketing and no trousers,” hinting that marketing campaigns often do not have a tangible product to market and the campaign is marketing a concept or a gut feeling. For PCB and IC substrate manufacturers, this poses a great risk for unsuccessful campaigns and the opportunity to innovate in an increasingly competitive and global landscape.
Beyond the Board: How Advanced PCB Design Is Reshaping Mil/Aero Electronics
03/10/2026 | Jesse Vaughan -- Column: Beyond the BoardAs mil/aero electronics evolve toward higher data rates, greater processing density, and tighter mechanical envelopes, integration is no longer occurring primarily at the box level, but rather deep within the electronic architecture itself, often beginning at the printed circuit board.