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Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products

05/01/2024 | Real Time with...IPC APEX EXPO
Chris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.

Rogers Corporation Reports Q1 2024 Results

04/26/2024 | Rogers Corporation
Net sales of $213.4 million increased 4.3% versus the prior quarter resulting from higher sales in the AES and EMS business units. AES net sales increased by 4.1% primarily related to higher aerospace and defense (A&D), wireless infrastructure, industrial and renewable energy sales, partially offset by lower EV/HEV and ADAS sales. EMS net sales increased by 2.8% primarily from higher general industrial, A&D and EV/HEV sales, partially offset by seasonally lower portable electronics sales.

Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design

04/25/2024 | Cadence Design Systems
Cadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.

NOTE Releases Interim Report for January-March 2024.

04/23/2024 | NOTE
NOTE has announced its interim report for January-March 2024.

Altus Group Helps BitBox Unlock Productivity and Efficiency Gains with New Reflow Oven

04/22/2024 | Altus Group
Altus Group, a leading provider of capital equipment, has recently assisted BitBox, a UK-based electronics design, engineering and manufacturing company in upgrading its operations with the implementation of a new reflow oven from Heller Industries.
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