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High Density Packaging User Group (HDP) Welcomes Lincstech as New Member

07/01/2025 | High Density Packaging User Group
High Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.

Zhen Ding's 2025 Lean & Digital Initiative Presentation Conference Concludes Successfully, Driving Group Transformation

07/01/2025 | Zhen Ding
To advance its digital transformation strategy and embody the CA- PDCA continuous improvement philosophy, Zhen Ding Technology Group (Zhen Ding) successfully hosted the 2025 H1 Lean & Digital Initiative Presentation Conference.

PCBA Market to Reach $147.5 Billion by 2035, Growing at a CAGR of 4.7% from 2025

06/27/2025 | PRNewswire
The Printed Circuit Board Assembly market is projected to reach $147.5 billion by 2035, up from an estimated $90.91 billion in 2025, growing at a steady CAGR of 4.7% during the forecast period.

North American PCB Industry Sales Up 21.4% in May

06/20/2025 | IPC
IPC announced the May 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.03.

Connect the Dots: The Future of PCB Design and Manufacturing

07/02/2025 | Matt Stevenson -- Column: Connect the Dots
For some time, I have been discussing the increasing complexity of PCBs and how designers can address the constantly evolving design requirements associated with them. My book, "The Printed Circuit Designer’s Guide to… Designing for Reality," details best practices for creating manufacturable boards in a modern production environment.
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