Best Papers from SMTA International Announced
February 2, 2024 | SMTAEstimated reading time: 2 minutes
The SMTA is pleased to announce the Best Papers from SMTA International 2023. The winners were selected by members of the conference technical committee. This year awards were given for the "Best of Proceedings" category but also for a new designation of "Best Practical and Applications-Based Knowledge." A plaque is given to primary authors of all winning papers for these exceptional achievements.
The following paper was selected for the “Best of Proceedings” award:
"A Collaborative Consortia Project to Assess the Effect of Thermal Cycling Dwell Time on the Reliability of High-Performance Solder Alloys." Richard Coyle, Ph.D., Nokia Bell Labs, and Joint Chair of the iNEMI and HDP 3rd Generation Solder Alloy Project accepts the award on behalf of the Collaborative iNEMI and HDP Consortia Teams.
The following three papers received honorable mention in this category:
"Study of the FCBGA Package Interfaces Reliability Under Monotonic and Fatigue Loads after Sustained High Temperature" by Pradeep Lall, Ph.D., Aathi Pandurangan, Padmanava Choudhury, and Madhu Kasturi, Auburn University.
"A Path to Ductile Low Temperature Solders for Mass production of Electronic Assemblies" by Keith Sweatman, P.E., Nihon Superior; Xin Fu Tan, Qichao Hao, Stuart D. McDonald, Michael Bermingham, Kazuhiro Nogita, The University of Queensland; Qinfen Gu, ANSTO; and Tetsuro Nishimura, Nihon Superior.
"Comparison of Electromigration in Tin-Bismuth Planar and Bottom Terminated Component Solder Joints." Prabjit Singh, Ph.D., IBM Corporation, and Technical Leader of the iNEMI Electromigration Project accepts the award on behalf of the iNEMI project team.
The following paper was selected for the “Best Practical and Applications-Based Knowledge” award:
"Managing Thermomechanical Behaviour in Automotive Electronics" by Maurice Dore, Valeo.
The following two papers received honorable mention in this category:
"Intermetallic Compounds in Solder Alloys: Common Misconceptions" by David Hillman, Hillman Electronic Assembly Solutions; Tim Pearson, Collins Aerospace; and Richard Coyle, Ph.D., Nokia Bell Labs.
"Performance Comparison of Contemporary Stencil Coatings and Under Wipe Solvents on 0.4mm BGA Packages" by Chrys Shea, Shea Engineering Services; Debbie Carboni, KYZEN Corporation; and John Hanerhoff, Garmin International.
The authors will receive their awards during a ceremony at SMTA International 2024. The SMTA International Conference and Exhibition (SMTAI) 2024 will be held October 21 - 24, 2024 at the Donald E. Stephens Convention Center in Rosemont, IL, USA. Details on participating in the 2024 SMTA International Conference are posted on the event website.
Suggested Items
Microchip Releases Its 2023 Sustainability Report Highlighting Its Environmental Stewardship and Social Impact
07/02/2024 | MicrochipOne of Microchip’s Guiding Values is “Professional Ethics and Social Responsibility Are Practiced,” which means that the company manages its business and treats its customers, employees, shareholders, investors, suppliers, channel partners, community and government in a manner that exemplifies honesty, ethics and integrity.
Regulatory Review of Renesas’ Acquisition of Altium Concludes
07/02/2024 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, and Altium Limited, a global leader in electronics design systems received notification from the Committee on Foreign Investment in the United States (CFIUS) on July 1, 2024 (PDT) that the investigation of the companies’ proposed merger transaction by way of a scheme of arrangement is complete and that there are no unresolved national security concerns with respect to the transaction.
Increase Test and Fault Coverage Through Interactive Tests
07/01/2024 | Acculogic Inc.New extended capabilities have been added to the proven integration package combining the FLS 980Dxi flying probe tester from Acculogic with the Embedded JTAG Solutions from GOEPEL electronic.
indie Semiconductor Introduces Class-leading Computer Vision Processor Family
06/28/2024 | BUSINESS WIREindie Semiconductor, Inc., an Autotech solutions innovator, announced the addition of a highly innovative iND880xx product line to its fast-growing vision processor portfolio, developed to address the demanding specifications of Advanced Driver Assistance Systems (ADAS) and driver viewing use cases, such as Surround View systems and Electronic Mirrors.
Renesas UPDATE: Regarding Acquisition of Stock of Altium Limited
06/28/2024 | RenesasAs announced in the press release “Regarding Acquisition of Stock of Altium Limited” issued on February 15, 2024, Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, entered into a Scheme Implementation Agreement for Renesas to acquire Altium Limited.