Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability

07/10/2025 | Microchip
Continuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.

Green Circuits to Discuss High-Reliability Space Electronics in Booth 233 at the 2025 Small Satellite Conference

07/10/2025 | Green Circuits
Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce its participation in the 39th Annual Small Satellite Conference, taking place August 10–13, 2025, in Salt Lake City, Utah.

ASMPT Introduces AERO PRO High-Performance Wire Bonder

07/09/2025 | ASMPT
ASMPT, the world’s leading provider of hardware and software solutions for semiconductor and electronics manufacturing, introduces its latest high-performance wire bonder: the AERO PRO.

FTG Announces Q2 2025 Financial Results

07/09/2025 | Globe Newswire
Firan Technology Group Corporation announced financial results for the second quarter 2025. Revenue: Recorded at $48.7 million, a 25.6% increase over Q2 2024.

Globalstar Signs Launch Services Agreement with SpaceX

07/08/2025 | BUSINESS WIRE
Globalstar, Inc., a next-generation telecommunications infrastructure and technology provider, announces that the Company has signed an agreement with SpaceX for a Falcon 9 launch for the next set of satellites, pursuant to the 2022 satellite procurement agreement with MDA.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in