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"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

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American Made Advocacy: How Congress Can Restore the U.S. Printed Circuit Board Industry

01/20/2026 | Shane Whiteside -- Column: American Made Advocacy
In 2026, the global PCB industry will see strong growth driven by data centers and the global race to create the most powerful artificial intelligence, along with the increased sophistication and production scale manufacturing of defense and infrastructure systems. Automotive technology innovations, the acceleration of unmanned systems production, and the continued proliferation of smart devices are also among the market forces driving global demand for microelectronics in general and PCBs in particular.

Voices of the Industry Podcast Examines Ceramic Substrates and Collaborative Manufacturing With Remtec

01/08/2026 | I-Connect007
Ceramic substrates continue to gain attention as electronics designers seek performance, reliability, and thermal advantages beyond traditional PCB materials. In the latest episode of Voices of the Industry, host Nolan Johnson welcomes Brian Buyea, president of Remtec, for an in-depth discussion on why ceramic substrates are an increasingly compelling option.

Revolutionizing PCB Manufacturing in the AI Era

12/22/2025 | Marcy LaRont, PCB007 Magazine
Artificial intelligence is reshaping every corner of the electronics ecosystem, and PCB manufacturing is under unprecedented pressure to evolve. In this exclusive conversation, Li Zhiqiang, general manager of Zhuhai Henger Microelectronics Equipment Co., Ltd., explains how plasma technology is emerging as a linchpin for next-generation AI hardware. As AI servers demand increasingly dense, high-performance PCBs, traditional chemical processes struggle to keep pace with new material systems and tighter reliability requirements.

How HDI/UHDI Manufacturing Converge With Interposers and Substrates

11/17/2025 | Marcy LaRont, I-Connect007
For decades, the PCB and the semiconductor package lived in separate universes. PCBs belonged to the world of board shops, panels, and assembly lines; packages belonged to semiconductor fabs and OSATs. Substrates and interposers, meanwhile, were niche system-level package “components” in the middle, largely invisible to the outside world. That separation is dissolving as definitions broaden. The rise of high-density interconnect (HDI) and its next-generation cousin, ultra HDI (UHDI), is pushing PCB manufacturing into territory once reserved for semiconductor packaging.

CELUS, NextPCB Establish Strategic Partnership to Accelerate AI-Driven Electronics Design and Manufacturing

11/07/2025 | BUSINESS WIRE
CELUS, the developer of a leading AI-assisted electronics design platform, and NextPCB, a globally recognized PCB manufacturing and assembly service provider, announced a strategic partnership aimed at streamlining the electronics development lifecycle from concept to mass production.
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