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iNEMI Packaging Tech Topic Webinar on Glass Substrates for Advanced Packaging will be conducted by Dr. Gang Duan & Dr. Dilan Seneviratne, Intel Corporation on February 20, 2024.
Heterogeneous integration through advanced packaging has become a crucial product performance enabler through on-package integration of chiplets with various functionalities and IP blocks. To meet future scaling needs, package substrate technologies must evolve beyond the capabilities of current organic substrates. Glass substrates have the mechanical, physical, electrical, and optical properties that allow for higher computing performance, better interconnect scaling, more design flexibilities, and larger form factor chiplet complex assemblies in a single package.
Intel is one of the first manufacturers to achieve glass substrates for advanced packaging solutions and is targeting delivery of this innovation to the market in the second half of this decade. Join guest speakers Gang Duan and Dilan Seneviratne (Intel Corporation) for a status overview of Intel’s glass core substrate package technologies and a discussion of advancements needed by the industry to enable high-performance computing needs through advanced packaging.
About the Speakers
Gang Duan, PhD, is a Principal Engineer and Area Manager / Engineering Director for Backend area in the Substrate Packaging TD organization within Assembly Test TD at Intel. He is responsible for developing EMIB / EMIB-TSV die embedding, as well as HDI substrate backend process, equipment, and materials technologies.
Dilan Seneviratne, PhD, is a Principal Engineer and Director of Dielectrics and Surface Prep Area in Intel’s Substrate Packaging Technology Development organization. He has worked on multiple generations of Intel’s substrate research and development programs and continues to drive future roadmaps critical for heterogenous integration and advance packaging.
Registration
This webinar is open to industry; advance registration is required. If you have any questions or need additional information, please contact Masahiro Tsuriya.
February 20, 2024
8:00-9:00 a.m. EST (US)
2:00-3:00 CET (Europe)
10:00-11:00 p.m. JST (Japan)
