Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

Cadence, NVIDIA Expand AI & Accelerated Computing Partnership

04/17/2026 | Cadence Design Systems, Inc.
At CadenceLIVE Silicon Valley 2026, Cadence announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based simulation and digital twins to unlock new levels of productivity and accelerate next‑generation engineering design flows across semiconductor design, physical AI systems and hyperscale AI factories.

Wolfspeed Launches Next-Gen AI Data Center Packaging with 300mm SiC Technology

03/26/2026 | Wolfspeed
Wolfspeed, Inc. , a global leader in silicon carbide technology, announced that its 300 mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler for advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade.

IISc, CADFEM & Synopsys Launch Advanced Simulation Center at CeNSE

03/26/2026 | PRNewswire
Ultra-high-speed electronic systems are increasingly shaping the technological frontier across sectors such as aerospace and defence, advanced healthcare, robotics, autonomous mobility, and high-performance computing.

RFMW, Powerex Sign Distribution Deal for High-Power Mission-Critical Semiconductors

03/24/2026 | BUSINESS WIRE
This partnership expands RFMW’s portfolio with Powerex’s extensive range of rectifiers, thyristors, IGBTs, SiC modules, and custom power assemblies designed for demanding high-power applications.

Infineon, DG Matrix Advance AI Data Center Power with SiC Technology

03/24/2026 | Infineon
Infineon Technologies AG and DG Matrix, a global leader in Solid-State Transformer (SST) solutions, are partnering to enhance the efficiency of power conversion required to connect AI data centers and industrial power applications to the public grid.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in