ASMC 2024 to Spotlight Advanced Semiconductor Manufacturing Innovations and Excellence
February 12, 2024 | SEMIEstimated reading time: 1 minute
Advanced semiconductor manufacturing topics ranging from yield management and metrology to new developments in manufacturing enabling AI and advancing technology nodes will take center stage at the SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024), May 13-16 in Albany, New York. Expected to draw hundreds of attendees from across the industry, the 35th annual ASMC will feature over 30 hours of technical and poster presentations by more than 120 industry experts on the latest manufacturing strategies and methodologies. Registration is now open.
ASMC is the premier event for industry professionals to network and share insights into best practices for semiconductor manufacturing. The conference is co-chaired by Bradley Wood, Applications Engineering Manager, CMP Filtration at Entegris, and Vijayalakshmi Seshachalam, CVD Process Engineer Lead at GlobalFoundries.
ASMC 2024 technical sessions will cover topics including:
- Advanced Equipment Processes and Materials
- Advanced Metrology
- Advanced Patterning / Design for Manufacturability / Design-Technology Co-Optimization
- Advanced Process Control
- Big Data Management and Mining
- Contamination Free Manufacturing
- Defect Inspection and Reduction
- Discrete and Power Devices
- Equipment Optimization
- Factory Automation
- Industrial Engineering
- Innovative Silicon Devices and Processes
- Lean Manufacturing
- Manufacturing for Sustainability
- Non-silicon and Non-CMOS
- Packaging and Through Silicon Via
- Smart Manufacturing
- The Fabless Experience
- Workforce Development
- Yield Enhancement/Learning
- Yield Methodologies
ASMC will also feature the panel discussion: Talent Pipeline: Building a Sustainable and Diverse Semiconductor Workforce. Panelists will include:
- Moderator: Shari Liss, Executive Director, SEMI Foundation
- Penny Hill, VP of Community, Professional and Workforce Development, Hudson Valley Community College
- Kevin Younis, COO and Executive Deputy Commissioner, Empire State Development
- Kylie Patterson, Senior Advisor, CHIPS for America
The Women in Semiconductors (WiS 2024) program takes place May 16 in conjunction with ASMC 2024. The program will address the importance of promoting diversity and inclusion in the workplace. Complimentary registration is available for ASMC attendees.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.