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The ICAPE Group Announces a Major Acquisition to Become One of the Leading Players in PCB Distribution in Japan

09/16/2024 | BUSINESS WIRE
The ICAPE Group, a global technology distributor of printed circuit boards (PCB) and custom-made electromechanical parts, announced the signature of a contract for the acquisition of 100% of the capital of the Japanese group NTW, specialized in the distribution of PCB in Asia, Completion of the acquisition is subject to customary suspensive conditions, and is expected to take place on September 19, 2024.

The ICAPE Group Reports Revenue for Q1 2024

05/16/2024 | ICAPE Group
The ICAPE Group, a global technology distributor of printed circuit boards (PCB) and custom-made electromechanical parts, announced its revenue for the first quarter of 2024.

Checking In With ICAPE Group

04/03/2024 | Nolan Johnson, I-Connect007
ICAPE Group’s field application engineer Erik Pederson drills down on sustainability, supply chain resiliency, and what value engineering really looks like in this exclusive interview. Founded in 1999, European-based ICAPE Group provides 21 million printed circuit boards and over six million technical parts to manufacturers every month. With 30 PCB manufacturing partners globally and 50 partners providing a wide array of technical parts, ICAPE Group has operations in China, Taiwan, Thailand, South Korea, Vietnam, South Africa, Europe, Mexico, and the United States. The company also focuses on the value proposition for its customers.

ICAPE Group Announces Its Full-Year Revenue for 2023

02/14/2024 | ICAPE Group
The ICAPE Group, a global technology distributor of printed circuit boards (PCB) and custom-made electromechanical parts, announced its revenue for the 2023 financial year, ending December 31.

ICAPE Announces Successful Arrangement of Financing

01/18/2024 | De Gaulle Fleurance
The ICAPE Group, a global technology distributor of printed circuit boards (“PCBs”), announces the successful arrangement of financing with a pool of 9 European banks, as well as the issue of Relance Bonds.
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