Indium Corporation Advisor to Present, Host Tutorial at TestConX 2024
February 14, 2024 | Indium CorporationEstimated reading time: 1 minute
![](https://iconnect007.com/application/files/5517/0791/2915/Dave_Saums_Indium.jpg)
Indium Corporation advisor, and founder/principal of DS&A LLC, Dave Saums will present on innovative thermal materials for semiconductor testing at TestConX 2024, held in Mesa, AZ, March 3-6. Saums will open the conference with a tutorial on March 3 and deliver a technical presentation on the topic on March 5.
The presentation, titled Testing Innovative Thermal Interface Materials for Semiconductor Test, will describe the testing practices for innovative thermal interface materials (TIMs) that are designed specifically for semiconductor test applications, or which are directly applicable. TIMs are available from hundreds of vendors, not all of whom are developers and manufacturers, in more than fourteen major, highly varied types, designed for a very wide variety of applications. Current industry standard test methodologies are outlined in ASTM D 5470-17, developed over three decades by a working committee of thermal industry engineers. This methodology provides a guideline for how test systems may be designed and constructed and for the general principals involved in testing TIMs. However, the very large number of different material types requires an understanding of the principal material categories, the intended purposes for the major types, and the differences encountered in thermal performance testing and reliability testing.
“Through the tutorial and presentation, my goal is to improve understanding of TIMs, the differentiators between categories, various testing methods, and types of TIM testing equipment,” said Saums. “I look forward to contributing to the industry’s collective tool kit by sharing these insights with my colleagues at TestConX.”
Saums has 45 years of experience in many aspects of electronics thermal management, for manufacturers and developers of military/aerospace high-reliability precision fans, high-volume heat-sinks and liquid cold plates, advanced TIMs, CTE-matched rigid thermal materials and substrates, and two-phase pumped dielectric liquid cooling systems. He operates a full-time consulting business addressing these products and markets, working with vendors, test equipment manufacturers, and system OEMs. Saums has previously conducted a tutorial for TestConX on thermal interface material classifications and has also given presentations at TestConX and BiTS. He holds B.S. and MBA degrees from Clarkson University, with post-graduate work at Union College.
Suggested Items
Thermal Greases for Computers, Electronics and High Tech Devices
07/19/2024 | epoxySetepoxySet produces a wide range of over 40 different thermally conductive greases. These greases are both silicone-based and silicone-free hydrocarbons.
BTU International Appoints E-Tronix as Its Representative in Six States
07/16/2024 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce the appointment of E-Tronix as its representative in North Dakota (ND), South Dakota (SD), Minnesota (MN), Iowa (IA), Wisconsin (WI) and Illinois (IL).
UHDI Fundamentals: UHDI for RF Microwave Applications
07/16/2024 | Anaya Vardya, American Standard CircuitsUltra high-density interconnect (UHDI) technology has significant potential for RF (radio frequency) microwave applications. Its advantages lie in its ability to provide high-density routing and integration, which are crucial for complex RF circuits. Here are three key UHDI benefits in RF microwave applications:
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 2
07/10/2024 | I-Connect007 Editorial TeamThe evolution of low-temperature solder alloys requires thoughtful consideration of the thermal and mechanical reliability requirements specific to each application. Thermal cycling and drop (mechanical) shock tests have long been used as board-level proxy tests for evaluating and quantifying the ability of electronics assemblies to sustain abrupt, short-term mechanical stresses, as well as continuous cyclic stresses.
Indium Corporation Introduces Cutting-Edge, High-Reliability Alloy for Solder Paste
06/14/2024 | Indium CorporationIndium Corporation is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology.