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Audits: A Critical Element of Process Control

09/03/2024 | Randy Cherry, IPC
A formal audit always seems difficult to justify. Companies do not want the expense, and employees do not want the hassle. There is always a chance of failure, and management struggles to understand the benefits. If you or your company has had issues with auditing, hopefully, this article will help you feel a little more comfortable about the auditing process.

Give Yourself an Edge at the IPC High Reliability Forum 2024

08/27/2024 | Marcy LaRont, PCB007 Magazine
For those who support military and defense products, few topics are more important than reliability, particularly as we venture into complex packaging requirements that accommodate next-gen chips and electronic systems. Recently, I visited with Teresa Rowe, IPC senior director, assembly and standards technology, to discuss the IPC High Reliability Forum (HRF), Oct. 9-10, at the McKimmon Center, in Raleigh, North Carolina. With topics that cover high-voltage electronics, standardized test methods, and assembly and solder joint X-ray challenges, it is clear that this event needs to be included on your annual conference calendar.

MVTec: Greater Interoperability Through Unified Machine Vision Standards

08/22/2024 | MVTec
Common standards and interfaces, especially in the machine vision segment, are the key to unlocking seamless interoperability between various systems and technologies.

Eurocircuits Installs Ledia 6 Hyper Direct Imager at Hungarian Production Site

08/19/2024 | Ucamco
Eurocircuits is proud to announce the installation of a new Ledia 6 Hyper direct imager at their production site in Hungary last year. This marks the company's fifth direct imager across its multiple production sites, highlighting Eurocircuits' ongoing commitment to enhancing production capabilities and ensuring top-notch service for its customers.

Dana on Data: The Evolution of Fabrication Drawing

08/15/2024 | Dana Korf -- Column: Dana on Data
In June, IPC released an excellent white paper called “Next Generation Design Needs,” presenting the need for the transformation of disparate design tools and processes. It’s time to eliminate silos. This paper could have been released at any time since the 1990s since the fundamental challenge has not significantly improved. The accepted data transfer process assumes that the manufacturer will fix the design documentation so boards can be manufactured to meet the design, reliability, and cost requirements.
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