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2024 IPC K-FEST: Shaping the Future of the Electronics Industry

12/06/2024 | IPC
IPC K-FEST 2024, the 2nd annual IPC Korea Festival of Electronics Standards and Technology, was held in Seoul on October 29. The focus of this year’s event centered on the integration of Korea's technological leadership with international standards development.

The Training Connection Difference

12/04/2024 | Andy Shaughnessy, I-Connect007
Bert Horner, president of The Test Connection, has recently launched The Training Connection, a new company that addresses critical training needs in test engineering and development. With a focus on essential methodologies like design for test (DFT) and IPC standards, the initiative promises to enhance the skills of professionals in the field. At PCB Carolina, Bert talked about the program, its positive reception, and the growing demand for practical, effective training solutions within the industry.

IPC Announces Two New Courses to Enhance Electronics Manufacturing Excellence

12/03/2024 | IPC
IPC is excited to announce the launch of two new courses designed to optimize electronics manufacturing processes: "Ensuring Excellence: IPC-J-STD-001 Process Optimization" and "Ensuring Excellence: IPC-A-610 Process Optimization."

IPC Japan Puts More Focus on Collaboration, Standards Development, Advanced Packaging

11/26/2024 | Yusaku Kono, IPC Japan Representative
In the past year, IPC has strengthened its relationships with key Japanese companies and government bodies. This was accomplished, in part, by a visit to Japan this past summer, where members of the IPC Asia team, punctuated by standards committee work last winter, forged stronger ties with government officials and companies involved in electronics manufacturing.

IPC Introduces First Standard for In-Mold Electronics

11/18/2024 | IPC
IPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
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