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Zero Defects International to Exhibit at Utah Expo and Tech Forum

09/04/2024 | Zero Defects International
Zero Defects International [ZDI] has announced their participation as an exhibitor at the SMTA Utah Expo and Tech Forum. It will be held at the Salt Lake City Marriott University Park.

Takaya Exhibiting Flying Probe Test Technology at SMTAI 2024

08/29/2024 | Takaya
TEXMAC, the exclusive authorized distributor of Takaya flying probe test systems in North and South America, will be exhibiting highlights of its advanced technology at SMTA International, October 20 - 24, 2024, at the Donald E. Stephens Convention Center in Rosemont, Illinois USA. 

Saki to Showcase Cutting-Edge Total Inspection Line Solutions at Productronica India 2024

08/28/2024 | Saki Corporation
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce its participation at productronica India 2024, one of the premier trade events for the electronics manufacturing industry in the region.

Asymmetric Hybrid Printed Circuit Board Design: Warpage Considerations

08/27/2024 | Kaspar Tsang, Gause Hu, Jimmy Hsu, Aje Chang, Alan Sun, Brian Ho, Ryan Chang, and Thonas Su
The printed circuit board (PCB) accounts for a significant portion of the PCBA’s (printed circuit board assembly) BOM (bill of material) cost. Designs with hybrid PCB stackup are adopted to reduce the cost of the PCB by using less expensive laminate materials in layers that do not have routings for high-speed signals (e.g., power and ground layers). The conventional hybrid PCB stackup design is symmetrical in the middle. This engineering technique has been employed in the data center industry for quite some time. To extend the idea and optimize the purpose of hybrid PCB stackup design, the feasibility of an asymmetric hybrid stackup is currently being studied.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/16/2024 | Nolan Johnson, I-Connect007
People are on the move, new books are being released, and a new PCB manufacturer is making waves. This week, I'm highlighting the latest ASC/Sunstone book on DFM essentials, our 40th book in the I-Connect007 library and a must-read whether you're a new or seasoned member of industry. I'm also including leadership news from NextFlex, a discussion on integrated passives from Joe Fjelstad, and a new processor chip from Intel meant specifically for automotive applications.
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