Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

IPC Update on the Latest U.S.– China Trade Announcement

06/18/2025 | IPC
On June 12, the Trump Administration announced an agreement to implement the framework of the trade deal with China reached earlier in May. Reports indicate the following high-level terms: A 55% combined tariff on imports from China, 10% “reciprocal” tariffs under the International Emergency Economic Powers Act (IEEPA), 20% IEEPA-based fentanyl tariffs, and Existing Section 301 tariffs, which in many cases are 25%.

STI Celebrates Travis Wease’s 10 Years of Dedicated Service

06/17/2025 | STI Electronics, Inc.
STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototyping, and contract electronic manufacturing, proudly celebrated the 10-year work anniversary of Travis Wease, Master Instructor and valued team member.

A.R.T. Ltd. Supports Release of IPC-A-600M

06/17/2025 | A.R.T. Ltd.
Advanced Rework Technology Ltd. (A.R.T. Ltd.), a leading provider of IPC-certified training and IPC authorised distributor, announces the release and availability of IPC-A-600M, the latest revision of the industry’s definitive standard for printed board acceptability.

Day 1: Cutting Edge Insights at the EIPC Summer Conference

06/17/2025 | Pete Starkey, I-Connect007
The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.

The Government Circuit: From Tax Policy to Tariffs, Denver to Delhi, Speaking Up for Electronics 

06/18/2025 | Chris Mitchell -- Column: The Government Circuit
I had the privilege of attending the June 3 opening ceremony of AT&S’s HTB3 facility in Leoben, Austria—a milestone moment for Europe’s electronics ecosystem. HTB3 is now the first and only facility in Europe capable of both developing and producing high-performance IC substrates—the advanced platforms that allow powerful chips to connect, process, and function. As demand for AI, 5G, and other cutting-edge technologies grows, so too does the need for sophisticated substrates like those HTB3 will produce.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in