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IPC Releases Newest List of Standards Updates, Revisions
February 20, 2024 | IPCEstimated reading time: 2 minutes

Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status.
IPC-1791D
Trusted Electronic Designer, Fabricator and Assembler Requirements
IPC-1791D provides minimum requirements, policies, and procedures for printed board design, fabrication, assembly, and cable and wire harness assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products.
IPC-6012F
Qualification and Performance Specification for Rigid Printed Boards
IPC-6012F covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias, and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance, as well as electrical, mechanical, and environmental requirements.
IPC-1782B
Standard for Manufacturing and Supply Chain Traceability of Electronic Products
IPC-1782B establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk. IPC-1782B applies to all products, processes, assemblies, parts, components, equipment used, and other items as defined by users and suppliers in the manufacture of printed board assemblies, as well as mechanical assembly and printed board fabrication.
IPC/WHMA-A-620E-S
Revision E—Addendum—Space and Military: Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620
IPC/WHMA-A-620E-S space addendum provides additional requirements to IPC/WHMA-A-620E standard to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal excursions encountered getting to and operating in the military and space environments.
IPC-2591-V1.6
Connected Factory Exchange (CFX)
IPC-2591, Version 1.6 establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. The standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semi-automated, and manual, and is applicable to related mechanical assembly and transactional processes.
IPC-9203A
Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
While there are a variety of industry test vehicles for the examination of material compatibility, the IPC-B-52 test board was created to meet the needs for testing both ion chromatograph and surface insulation resistance (SIR), which would be more representative of the manufacturing materials and processes. IPC-9203A standard addresses the IPC-B-52 test vehicle, which can be used to evaluate a manufacturing process, or to provide objective evidence that a chosen manufacturing material set and process are compatible from a cleanliness standpoint.
This list of standards originally appeared in the Winter 2024 issue of IPC Community. Read more articles about standards development work in each issue.
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Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
The Government Circuit: From Tax Policy to Tariffs, Denver to Delhi, Speaking Up for Electronics
06/18/2025 | Chris Mitchell -- Column: The Government CircuitI had the privilege of attending the June 3 opening ceremony of AT&S’s HTB3 facility in Leoben, Austria—a milestone moment for Europe’s electronics ecosystem. HTB3 is now the first and only facility in Europe capable of both developing and producing high-performance IC substrates—the advanced platforms that allow powerful chips to connect, process, and function. As demand for AI, 5G, and other cutting-edge technologies grows, so too does the need for sophisticated substrates like those HTB3 will produce.