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KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics

07/15/2025 | KONIG
KONIG, a leader in electronic packaging protection solutions, is proud to announce the launch of the KP400 3D Digital Packaging Solution—a breakthrough conformal coating system that brings new levels of precision, speed, and material efficiency to electronics manufacturing.

Electronics Manufacturing & Assembly Collaborative (EMAC) Announces Innovative Student Competition

07/15/2025 | EMAC
The Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced the launch of the Bright Manufacturing Challenge 2025, a revolutionary hands-on competition that transforms how students experience electronics manufacturing and robotics engineering.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/11/2025 | Andy Shaughnessy, Design007 Magazine
This week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)

07/10/2025 | Infineon
As the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.

The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application

07/02/2025 | Global Electronics Association
The Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
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