-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Know-how Transfer at Rehm - Digital and In-Person
February 26, 2024 | Rehm Thermal SystemsEstimated reading time: 5 minutes
Webinars, hybrid trade shows, digital meetings: Events in the workplace are increasingly shifting to the internet. The challenges of the Corona crisis have further accelerated this trend. Many companies now offer only online events, whether due to time or cost reasons. However, at Rehm Thermal Systems, you have a choice: the provider of thermal systems for various industries offers a variety of short, concise online webinars and complements them with in-depth in-person seminars on various topics.
Learn from the experts and be inspired by new industry solutions. The extensive webinar and seminar program offers you many opportunities to gain a knowledge advantage.
Registration for the webinars and seminars is done online at rehm-group.com.
March 7, 2024, and June 20, 2024 / 9:00 AM CET / CEST (Asia, Europe, ROW) and at 4:00 PM CET / CEST (America, Europe)
Webinar: Thermal Processes in Fuel Cell Manufacturing (English)
Fuel cells play a significant role in the energy transition, whether in stationary energy supply or in the field of e-mobility. In our webinar, we discuss the changing perspectives on the use of hydrogen as an energy carrier and the associated requirements for fuel cell production worldwide and in Europe.
Thermal systems are used for drying processes in the production of individual components for fuel cells. These drying processes with different requirements for the individual components of the fuel cell can be realized with solutions from the portfolio of Rehm Thermal Systems GmbH.
The German-language webinar on this topic will take place on March 6, 2024 and June 19, 2024 at 9:00 AM CET/CEST.
March 14, 2024 / 9:00 AM CET (Asia, Europe, ROW) and at 4:00 PM CET (America, Europe)
Webinar: Precise Application and Dosing: Automation for Challenging Processes in Medical Technology (English)
Automation is already established in many markets, with the increasing shortage of skilled workers driving companies in this direction. Medical technology also benefits from this development with positive effects for manufacturers and patients.
Bendable, irregular, and three-dimensional medical products such as catheters, prostheses, pacemakers, or stents are often still manually glued and encapsulated. Because the step towards automating these processes is often still associated with hurdles in the demanding MedTech market.
In our webinar, we provide an overview of the requirements of modern medical technology for such manufacturing processes as well as the benefits resulting from the automation of these processes.
The German-language webinar on this topic will take place on March 13, 2024 at 9:00 AM CET.
March 21, 2024 / 9:00 AM CET (Asia, Europe, ROW) and at 4:00 PM CET (America, Europe)
Webinar: Vapor Phase Soldering (English)
As the world's only manufacturer, Rehm offers not only convection soldering systems but also condensation or vapor phase soldering systems from a single source. Do you process large and heavy boards for which convection soldering is not an option? Or do you want a system that allows you to reliably carry out vacuum processes at any time? Then this webinar is just right for you.
The webinar focuses on the differences between vapor phase soldering and convection soldering, as well as application areas, technologies, and possibilities for integration into the existing manufacturing environment.
The German-language webinar on this topic will take place on March 20, 2024 at 9:00 AM CET.
April 10, 2024 / 9:00 AM CEST
In-Person Seminar: Temperature Profiling - Measurement Methods and Paths to Optimal Reflow Soldering Profile (only in German)
The world of electronic assemblies is so diverse and complex that it will not be possible to adequately represent all the specific needs of the components and materials. It remains the expertise and skill of the manufacturer to find the optimal reflow parameters. However, there are sufficient indications, clues, and experiences available to enable optimization.
Discover in our seminar how to distinguish the feasible from the myth. The first part of this seminar gives you insights into the basics and optimal parameters of reflow profiling. In the second part, you will learn to prepare a test board, understand the benefits of a thermal imaging camera, and create reflow profiles yourself.
Number of Participants: min. 15 persons / max. 20 persons
Participation Fee: 449 € per person including conference drinks, lunch, printed training materials
Venue: Rehm Thermal Systems GmbH, Leinenstrasse 7,
D-89143 Blaubeuren
April 25, 2024 / 9:00 AM CET (Asia, Europe, ROW) and at 4:00 PM CET (America, Europe)
Webinar: Next Generation Reflow Soldering - Focus on Energy Efficiency and Resource Conservation (English)
Convection reflow soldering has been used for decades as a robust and cost-effective joining method for the production of electronic assemblies. This process has been continuously shaped by various requirements. These include, among others, the switch to lead-free solders, throughput optimization, or sustainability.
The tense situation regarding the availability of resources such as electrical energy and nitrogen sets new goals and challenges for both plant technology and the process definition of soldering. In this webinar, our speakers will present, among other things, the plant- and process-specific possibilities of the new generation of systems to reduce these resource consumptions and will gladly answer your questions.
The German-language webinar on this topic will take place on April 24, 2024 at 9:00 AM CET.
May 16, 2024 / 9:00 AM CEST (Asia, Europe, ROW) and at 4:00 PM CEST (America, Europe)
Webinar: Smart Turnkey Solutions for your requirements (English)
The electronics industry is facing new challenges more and more, which drives it to peak performance. The requirements for the new generation of manufacturing systems have steadily increased: Today, it is no longer just about individual machines, but about line solutions, keyword "turnkey".
Find out in this webinar how Rehm can support you in configuring and implementing complex manufacturing lines, both in the soldering area and in dispensing and coating processes. Our many years of expertise in electronics manufacturing as well as our comprehensive product range combined with high software competence guarantee competent project support from planning to installation in your manufacturing environment.
The German-language webinar on this topic will take place on May 15, 2024 at 9:00 AM CEST.
June 27, 2024 / 9:00 Uhr MESZ
In-Person Seminar: : Reflow Soldering with Vacuum Assistance - Goals, Influencing Factors, and Experiences (only in German)
Currently, there is no reflow soldering process that cannot be combined with the vacuum option. While vacuum with convection soldering focuses on reducing pore content, vacuum in vapor phase soldering also serves to remove Galden® from the assemblies. In contact soldering, the vacuum option unfolds its complete multifunctionality.
This seminar is an exciting event that deals with the technique of reflow soldering with vacuum assistance. You will learn the basics of vacuum soldering, and practical content will be conveyed particularly within the lectures and workshops. The seminar offers an ideal opportunity to expand your knowledge in this area and to exchange ideas with other experts.
Number of Participants: min. 15 persons
Participation Fee: 395 € per person including conference drinks, lunch, printed training materials
Venue: Rehm Thermal Systems GmbH, Leinenstrasse 7, D-89143 Blaubeuren
Participation in the webinars is free of charge. Please refer to the seminar description on the website rehm-group.com for the participation fees for the in-person seminars.
Suggested Items
Boeing Commits to Expand South Carolina Operations
12/20/2024 | BoeingBoeing announced it plans to expand its operations in Charleston County. The company plans to invest $1 billion in infrastructure upgrades at its existing site and create 500 new jobs over the next five years.
Cicor Publishes Nine-month Results Report due to OEP Mandatory Offer
12/20/2024 | CicorCicor Group is publishing a nine-month report today. OEP has published a mandatory offer after it converted its Mandatory Convertible Bonds (MCNs) and thereby crossed the mandatory offer threshold.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/20/2024 | Nolan Johnson, I-Connect007Hey, wait a minute, this is the lead-up to the penultimate holiday week, so why is the news cycle so busy? Normally, this period of time—what with all the holiday distraction—is when companies either go quiet or publish press releases covering those throwaway news items. Instead, this week brought in so much important news that I had to be quite discerning in my choices. Newsletter subscribers definitely got a lot of news this week.
Siemens Extends Veloce Hardware-assisted Verification Support of EPGM Ethernet to 1.6 Tbps
12/18/2024 | SiemensSiemens Digital Industries Software announced today an extension of its Veloce™ hardware-assisted verification platform to support 1.6 Tbps Ethernet. As a core component of the Siemens software/hardware and system validation platform, Veloce delivers complete virtual models to support Ethernet Packet Generator and Monitor (EPGM) Ethernet port speeds up to 1.6 Tbps.