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MEK Launches New PowerSpector JSAz 550: Larger 3D Desktop AOI System with New Chassis

09/11/2024 | MEK
Mek (Marantz Electronics), a leader in Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) technology, proudly announces the launch of its latest product, the PowerSpector JSAz 550. This new selective 3D desktop AOI system is a larger L-size model, capable of accommodating Printed Circuit Boards (PCBs) up to 550x550mm (21.7”x21.7”).

Sondrel Announces Advanced Modelling Process for AI Chip Designs

09/10/2024 | Sondrel
Sondrel, a leading provider of ultra-complex custom chips for leading global technology brands, has announced an Advanced Modelling Process for AI chip designs.

Qualcomm Expands Performance Leadership to More Copilot+ PC Users with New Snapdragon X Plus 8-core

09/10/2024 | Qualcomm Technologies, Inc.
Ahead of IFA 2024, Qualcomm Technologies, Inc. announced the expansion of its Snapdragon X Series portfolio with the introduction of Snapdragon® X Plus 8-core, a breakthrough platform that unleashes multiday battery life, unprecedented performance and AI-powered Copilot+ experiences to even more people.

TeraHive Launches Intelligent Energy Management Solutions

09/09/2024 | BUSINESS WIRE
TeraHive, an intelligent energy management solution provider, backed by global leader LITEON Technology, announced today the launch of three smart energy solutions: the TeraHive Energy Suite, Charging Station Management Solution and Enterprise Energy Management.

September Design007 Magazine: Silicon to Systems

09/09/2024 | I-Connect007 Editorial Team
The increase in complexity in electronics is driving technologists throughout the electronics supply chain to adopt a “silicon to systems” outlook. This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain—from soup to nuts.
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