-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Electronics Industry Praises U.S. Government Notice of Funding Opportunity for 'Advanced Packaging' Technologies
February 29, 2024 | IPCEstimated reading time: 2 minutes
IPC praised today’s issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a Notice of Funding Opportunity (NOFO) for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials.
“IPC applauds this very important milestone in the work to build a more resilient semiconductor manufacturing supply chain in North America,” said Richard Cappetto, Senior Director of North American Relations at IPC. “Today’s action is a welcome milestone following years of education and advocacy work by IPC and our partners. It will help ensure that the United States can bridge current gaps in its semiconductor supply chain and position itself to be a leader in the global marketplace with the ability to manufacture cutting-edge technologies.”
Advanced packaging is driving semiconductor innovation by introducing greater electronic interconnection within semiconductor packages. Electronic interconnection is key to U.S. semiconductor leadership, and industry leaders call advanced packaging the “new king” of innovation in the chips sector.
The NOFO makes $300 million available for multiple awards of up to $100 million each for up to five years. Investments will be focused on projects that achieve ambitious targets for one or more of the program’s chief objectives:
- Accelerate domestic R&D and innovation in advanced packaging materials and substrates;
- Translate domestic materials and substrate innovation into U.S. manufacturing;
- Support the establishment of a robust, sustainable, domestic capacity for advanced packaging materials and substrate R&D, prototyping, commercialization, and manufacturing; and
- Promote a skilled and diverse pipeline of workers for a sustainable domestic advanced packaging industry.
IPC is the leading advocate for a “silicon-to-systems” approach to the CHIPS and Science Act, recognizing the importance of silicon fabrication but also the need for related electronics manufacturing capabilities—including advanced packaging, printed circuit boards (PCBs), and IC substrates.
IPC’s influential 2021 report, North American Advanced Packaging Ecosystem Gap Assessment, found the U.S. has only just begun to invest in advanced packaging, while nations in Asia have sprinted ahead to develop the lion's share of capabilities and capacity. That report was referenced both in today's NOFO and in the CHIPS Office’s guiding document for the National Advanced Packaging Manufacturing Program. An IPC Symposium on Advanced Packaging in 2022 also helped propel government action.
For more information, visit www.ipc.org/solutions/ipc-advanced-packaging-technology.
Suggested Items
RTX's Raytheon Completes First Flight Test for PhantomStrike Radar
05/08/2025 | RTXRaytheon, an RTX business, has successfully completed the first flight test of its PhantomStrike radar on its Multi-Program Testbed aircraft in Ontario, California. PhantomStrike successfully tracked several airborne targets and accurately mapped the terrain.
MKS Breaks Ground on New Chemical Manufacturing and TechCenter Facility in Thailand
05/07/2025 | MKS Instruments, Inc.MKS Instruments. Inc., a global provider of enabling technologies that transform our world, announced today the groundbreaking of its cutting-edge Atotech chemical manufacturing and TechCenter facility at the Asia Industrial Estate Suvarnabhumi, located east of Bangkok, Thailand.
Baker Hughes' Waygate Unveils Nanotom HR for Advanced Inspection
05/06/2025 | Baker HughesWaygate Technologies, a Baker Hughes business and global leader in nondestructive testing (NDT) solutions for industrial inspection, unveiled its new extremely high-resolution computed tomography (CT) system, Phoenix Nanotom® HR (High Resolution) at the Control 2025 show in Stuttgart, Germany.
Libra Industries Boosts SMT and Electronics Manufacturing Capabilities in Dallas, Texas
05/06/2025 | Libra IndustriesLibra Industries is excited to announce the latest upgrades to its surface mount technology (SMT) capabilities at its Dallas, Texas facility.
Koh Young Invites You to the 2025 IEEE Electronic Components and Technology Conference
05/06/2025 | Koh YoungKoh Young, the industry leader in True3D™ measurement-based inspection solutions, invites you to join us at the 2025 IEEE Electronic Components and Technology Conference (ECTC), taking place May 27–30, 2025, at the Gaylord Texan Resort & Convention Center in Grapevine, Texas