Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

iNEMI Packaging Tech Topic Webinar: Overcoming Challenges in 3D Packaging Test & Inspection

01/23/2025 | iNEMI
Register today for a free webinar on February 13th to explore emerging solutions for testing and inspecting complex 3D semiconductor packaging.

AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Austin Expo & Tech Forum

01/16/2025 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Austin Expo & Tech Forum taking place on February 6 at the Travis County Exposition Center in Austin, Texas.

SMTA Announces Wafer-Level Packaging Symposium Program

01/08/2025 | SMTA
The SMTA is excited to announce the technical program for the 2025 Wafer-Level Packaging Symposium. The symposium will be held February 18-20, 2025 at The Hyatt Regency San Francisco Airport in San Francisco, California.

IPC Announces UK Regional Qualification for Hand Soldering Competition

01/02/2025 | IPC
IPC  invites skilled soldering experts to participate in the UK Regional Qualification for the IPC Hand Soldering Competition (HSC) on February 4-6, 2025, at the Farnborough International Exhibition Centre.

SMTA Austin Expo & Tech Forum Returns February 6, 2025

10/30/2024 | SMTA
The Surface Mount Technology Association (SMTA) Austin Expo & Tech Forum is set to take place on Thursday, February 6, 2025 from 8:30 a.m. - 4:00 p.m. at the Travis County Exposition Center.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in