Cadence Expands Tensilica Vision Family with Radar Accelerator and New DSPs Optimized for Automotive Applications
March 4, 2024 | Cadence Design Systems, Inc.Estimated reading time: 3 minutes
Cadence Design Systems, Inc. expanded its Tensilica IP portfolio to address the increasing computational requirements associated with automotive sensor fusion applications. The new high-performance Cadence® Tensilica® Vision 331 DSP and Vision 341 DSP combine vision, radar, lidar and AI processing in a single DSP for multi-modal, sensor-based system designs, delivering the best energy efficiency in the smallest area. When paired with the new Cadence Tensilica Vision 4DR Accelerator optimized for 4D imaging radar applications, customers can achieve even greater radar performance and higher energy efficiency. A major automotive SoC provider and early access customer has selected the Vision 341 DSP for its next-generation automotive SoC, demonstrating customer demand for these new solutions.
Cadence expanded its Tensilica IP portfolio with two new Vision DSPs and a radar accelerator to address automotive sensor fusion applications. The new high-performance Cadence Tensilica Vision 331 DSP and Vision 341 DSP combine vision, radar, lidar and AI processing in a single DSP for multi-modal, sensor-based system designs, delivering the best energy efficiency in the smallest area.
Cadence expanded its Tensilica IP portfolio with two new Vision DSPs and a radar accelerator to address automotive sensor fusion applications. The new high-performance Cadence Tensilica Vision 331 DSP and Vision 341 DSP combine vision, radar, lidar and AI processing in a single DSP for multi-modal, sensor-based system designs, delivering the best energy efficiency in the smallest area.
“Automotive architectures continue to evolve with the current focus on software-defined vehicles and the growing prevalence of driver and occupancy monitoring systems,” said Raphaël Da Silva, Technology and Market Analyst at Yole Group. “With the automotive race towards eyes off, a mix of radars, cameras and Lidars are necessary to ensure optimal safety performance in all conditions. There are more than 40 sensors in a vehicle today, and that number will only continue to grow. Having these capabilities in a single, highly programmable DSP with a broad ecosystem is advantageous, particularly as imaging and 4D radar are expected to grow at a >40% CAGR from 2023 to 2028 and >131% for in-cabin use as noted in the Yole Intelligence Radar for Automotive 2023 report.”
The new Vision 341 DSP and Vision 331 DSPs combine the proven Tensilica ConnX and Vision instruction-set architectures to offer SoC providers for automotive, drone, robotics and autonomous vehicle systems a highly programmable, single-DSP solution for image sensing, radar, lidar and AI workloads. Other features and benefits include:
- The 1024-bit Vision 341 DSP provides 2X multiply-accumulate (MAC) capability compared to the Vision 331 DSP while delivering the best performance and energy efficiency compared to GPUs or CPUs.
- For certain 4D imaging radar workloads, the 512-bit Vision 331 DSP offers up to 4X performance improvement over the Vision 230 DSP in radar boost mode, while the Vision 341 DSP offers up to 6X performance improvement compared to the Vision 230 DSP.
- When paired with the new DSPs for 4D imaging radar applications, the Vision 4DR accelerator offers 3X greater performance and up to 6X greater performance/area advantage compared to a Vision 341 DSP alone and 5X greater performance compared to a Vision 331 DSP alone.
- The new Vision DSPs deliver up to 2X computer vision performance improvements for computer vision filter and NMS algorithms, as well as AI improvements for quantization and depthwise separable convolution.
The Vision 341 and Vision 331 DSPs support the Tensilica Instruction Extension (TIE) language, allowing customers to customize the instruction set. The Cadence NeuroWeave™ Software Development Kit (SDK) provides neural network support for both DSPs. In addition, the Vision 341 and Vision 331 DSPs support more than 1700 OpenCV-based vision library functions, SLAM Library, Point Cloud Library (PCL), Radar library, Nature DSP library, OpenCL and the Halide compiler for computer vision, imaging, radar and lidar applications. Both cores are automotive ready with ASIL-B hardware random faults and ASIL-D systematic fault certification.
“With the growing prevalence of vision transformers, automotive SoC and systems companies need best-in-class performance for sensor fusion applications. Increasingly, they are seeking a highly flexible single-DSP solution for computer vision, radar and lidar with AI processing,” said David Glasco, VP of R&D for the Silicon Solutions Group at Cadence. “As the leading provider of vision and radar DSP IP, we’re extremely well positioned to capitalize on this growing need by offering our customers the best of both worlds in a single DSP with optional radar acceleration for emerging 4D radar applications.”
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Aircraft Wire and Cable Market to surpass USD 3.2 Billion by 2034
10/30/2025 | Global Market Insights Inc.The global aircraft wire and cable market was valued at USD 1.8 billion in 2024 and is estimated to grow at a CAGR of 5.9% to reach USD 3.2 billion by 2034, according to recent report by Global Market Insights Inc.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
AI Triggers Next Paradigm Shift in PDN
10/23/2025 | Istvan Novak, SamtecArtificial intelligence (AI), together with machine learning (ML), is creating an unprecedented surge of computing and networking infrastructure needs. This, in turn, has dramatically increased the power consumption of computing and networking chips.