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September 2025 PCB007 Magazine: The Future of Advanced Materials
September 16, 2025 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
The advancement of materials for printed circuit boards, interconnects/interposers, and substrates is of great interest, and for good reason. Moore’s Law is no more, and the solutions to grapple with this reality are surprising, stunning, and perhaps—for those looking to plate onto them—a bit daunting. They hold amazing potential for the next chapters of the electronics manufacturing journey.
Our advanced materials vendor line-up features Ventec, Isola, Arlon, EMC, Rogers, and AGC, each discussing their solutions (and products) that address high-speed signal integrity, excessive thermal stress and heat management, Dk variability with fine features, and applications that must operate reliably and for long periods of time in harsh environments.
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Jiva Leading the Charge Toward Sustainable Innovation
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U.S. Critical Materials, GreenMet Join Forces in Strategic Alliance for Gallium and Critical Mineral Independence
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Connect the Dots: Evolution of PCB Manufacturing—Lamination
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