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September 2025 PCB007 Magazine: The Future of Advanced Materials
September 16, 2025 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
The advancement of materials for printed circuit boards, interconnects/interposers, and substrates is of great interest, and for good reason. Moore’s Law is no more, and the solutions to grapple with this reality are surprising, stunning, and perhaps—for those looking to plate onto them—a bit daunting. They hold amazing potential for the next chapters of the electronics manufacturing journey.
Our advanced materials vendor line-up features Ventec, Isola, Arlon, EMC, Rogers, and AGC, each discussing their solutions (and products) that address high-speed signal integrity, excessive thermal stress and heat management, Dk variability with fine features, and applications that must operate reliably and for long periods of time in harsh environments.
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Sealed for Survival: Potting Electronics for the Toughest Environments
10/29/2025 | Beth Massey, MacDermid Alpha Electronics SolutionsElectronics deployed in harsh conditions face relentless threats from vibration, impact, chemical contaminants, airborne pollutants, and moisture, conditions that can quickly lead to failure without robust protection. Potting, the process of encapsulating electronics in a protective polymer, is a widely used strategy to safeguard devices from both environmental and mechanical hazards.
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
10/28/2025 | Kurt Palmer -- Column: Driving InnovationRigid-flex printed circuit boards are a highly effective solution for placing complex circuitry in tight, three-dimensional spaces. They are now indispensable across a range of industries, from medical devices and aerospace to advanced consumer electronics, helping designers make the most efficient use of available space. However, their unique construction—combining rigid and flexible materials—presents a fundamental challenge for PCB manufacturers.
SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
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ITW EAE Despatch Ovens Now Support ASTM 5423 Testing
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Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).