September 2025 PCB007 Magazine: The Future of Advanced Materials

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Suggested Items

NUBURU Defense Unveils Italian Plan, Strengthens Strategic Team

06/17/2026 | BUSINESS WIRE
The plan is expected to be supported by senior strategic advisers Prof. Carlo Alberto Carnevale Maffè and Gen. Pietro Serino.

TSMC Accelerates CoPoS Development; Taiwan Suppliers Leverage FOPLP for Glass Core Substrates

06/17/2026 | TrendForce
The rapid growth of demand for AI semiconductors is driving the evolution of advanced packaging technologies, with Fan-Out Panel-Level Packaging (FOPLP) emerging as a new battleground across the industry.

A.R.T. Supports IPC/WHMA-A-620 Revision F with Updated Training Materials

06/16/2026 | A.R.T. Ltd.
Advanced Rework Technology Ltd. (A.R.T. Ltd.), a leading provider of IPC-certified training and an IPC-authorized distributor, is supporting the transition to IPC/WHMA-A-620 Revision F with updated training materials for cable and wire harness assembly.

Will This PCB Material Still Be Available in 30 Years?

06/16/2026 | Laura Martin, Isola
One of the most common questions I receive from aerospace and defense customers has nothing to do with dielectric constant, dissipation factor, or thermal performance. Instead, the conversation often starts with a simple question: "If we design this material into our platform today, will it still be available in 30 years?"

Getters for Hermetic Packages: Mechanisms, Reliability Impact, and MacDermid Alpha Electronics Solutions

06/11/2026 | Michael Previti, MacDermid Alpha Electronics Solutions
Hermetic packages protect chips, lasers, and sensors from the outside world, but the cavity inside can still change after seal. Small amounts of water, hydrogen, carbon dioxide, and organic vapor may remain after build or may form later from adhesives, films, and other internal materials. Getters reduce that risk by creating a planned sink for those gases inside the package. When teams choose the right getter early, they hold the headspace steady, cut reliability escapes, and lower the life-cycle cost of a high-value device.