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PCBAA Welcomes CHIPS Program Investing in American Made Substrates
March 5, 2024 | PCBAAEstimated reading time: 1 minute
The Printed Circuit Board Association of America welcomes the CHIPS for America program action to make available $300 million via a Notice of Funding Opportunity (NOFO) for domestic research and development activities to accelerate domestic capacity for advanced packaging substrates and substrate materials.
Integrated circuit substrates are a critical part of the technology stack that powers the microelectronics that make modern life possible. Semiconductors, substrates and printed circuit boards (PCBs) make up the stack that every electronic device needs to function.
PCBAA Executive Director David Schild said, “This is an important expansion of the work being done at the CHIPS program to reshore the industries we invented here in America but long ago offshored. To build a secure and resilient supply chain for all elements of the technology stack, we need a robust American capacity to manufacture all three: semiconductors, IC substrates and PCBs. That’s why we say ‘Chips Don’t Float’. The third element of the technology stack also needs government investment. We are calling on Congress to pass H.R. 3249, the Protecting Circuit Boards and Substrates Act, which would provide $3 billion to fund factory construction, workforce development and R&D along with a 25% tax credit for purchasers of American-made PCBs and substrates."
PCBAA was founded by leading microelectronics manufacturers to educate, advocate and legislate on behalf American-made PCBs, substrates and the raw materials from which they are made.
For more information, contact Mike Doble at (703) 579-7963, mikedoble@pcbaa.org
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SCHMID Group Expands Advanced Packaging Portfolio to Power the AI Era
10/14/2025 | EINPresswire.comSCHMID Group, a leading global provider of equipment and solutions for the electronics industry, announces a major expansion of its product portfolio to meet the surging demand for two types of products: Advanced packaging substrates and high-performance server boards, in the era of Artificial Intelligence (AI).
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
SCHMID Advances Next-Gen Advanced Packaging with New InfinityLine and Glass Core Substrate Solutions
09/29/2025 | SCHMID GroupSCHMID Group, a leading global provider of equipment and solutions for the electronics industry, announces a major expansion of its product portfolio to meet the surging demand for two types of products: Advanced packaging substrates and high-performance server boards, in the era of Artificial Intelligence (AI).
Zhen Ding Reports Record 1H25 Revenue with Increasing Profits
08/13/2025 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, held an investor conference and announced its consolidated financial results for the second quarter and first half of 2025.
ASMPT Introduces MEGA Multi-chip Bonding Platform
08/06/2025 | ASMPTASMPT SEMI, a leading provider of forward-looking solutions for advanced packaging and semiconductor assembly, sets the standard in precision and speed with its new MEGA multi-chip bonding platform.