-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
PCBAA Welcomes CHIPS Program Investing in American Made Substrates
March 5, 2024 | PCBAAEstimated reading time: 1 minute
The Printed Circuit Board Association of America welcomes the CHIPS for America program action to make available $300 million via a Notice of Funding Opportunity (NOFO) for domestic research and development activities to accelerate domestic capacity for advanced packaging substrates and substrate materials.
Integrated circuit substrates are a critical part of the technology stack that powers the microelectronics that make modern life possible. Semiconductors, substrates and printed circuit boards (PCBs) make up the stack that every electronic device needs to function.
PCBAA Executive Director David Schild said, “This is an important expansion of the work being done at the CHIPS program to reshore the industries we invented here in America but long ago offshored. To build a secure and resilient supply chain for all elements of the technology stack, we need a robust American capacity to manufacture all three: semiconductors, IC substrates and PCBs. That’s why we say ‘Chips Don’t Float’. The third element of the technology stack also needs government investment. We are calling on Congress to pass H.R. 3249, the Protecting Circuit Boards and Substrates Act, which would provide $3 billion to fund factory construction, workforce development and R&D along with a 25% tax credit for purchasers of American-made PCBs and substrates."
PCBAA was founded by leading microelectronics manufacturers to educate, advocate and legislate on behalf American-made PCBs, substrates and the raw materials from which they are made.
For more information, contact Mike Doble at (703) 579-7963, mikedoble@pcbaa.org
Suggested Items
IPC Applauds Leadership of Reps. Moore and Krishnamoorthi on PCB Manufacturing Bill
05/28/2025 | IPCIPC, the global electronics association serving more than 1,400 U.S. companies and over 3,200 worldwide, strongly supports the bipartisan reintroduction on May 28 of the Protecting Circuit Boards and Substrates (PCBS) Act in the 119th Congress.
Zhen Ding Reported Its 1Q25 Results, with Revenue Hitting a Record High for the Same Period
05/16/2025 | Zhen Ding TechnologyZhen Ding Technology Holding Limited a global leading PCB manufacturer, today announced its consolidated financial results for the first quarter of 2025.
Global SiC Substrate Revenue Declines 9% in 2024; Long-Term Demand Remains Strong as 8-Inch Roadmap Gains Momentum
05/12/2025 | TrendForceTrendForce’s latest research shows that weakening demand in the automotive and industrial sectors has slowed shipment growth for SiC substrates in 2024.
Zhen Ding Releases April 2025 Monthly Revenue Report
05/07/2025 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported April 2025 revenue of NT$13,589 million, up 22.90% YoY, marking a record high for the same period in the company’s history.
TASMIT Launches Large Glass Substrate Inspection System for Advanced Semiconductor Packaging
03/04/2025 | ACCESSWIRETASMIT Inc. has launched a new inspection system for glass substrates as part of its INSPECTRA® series of semiconductor wafer visual inspection systems, which has gained attention for its high efficiency in advanced semiconductor manufacturing.