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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

SIA Commends CHIPS Awards to Accelerate Advanced Compute Semiconductor R&D

07/30/2026 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding seven R&D awards announced by the CHIPS Research and Development Office (CRDO) to accelerate semiconductor R&D for the advanced compute supply chain.

Amphenol Reports Record Q2 2026 Results, Sales Reach $8.8B

07/30/2026 | BUSINESS WIRE
The Company continues to deploy its financial strength in a variety of ways to increase shareholder value. During the second quarter, the Company purchased 1.5 million shares of its common stock for $208 million and paid dividends of $307 million, resulting in total capital returned to shareholders of $515 million.

Electronics Assembly Robotics Market to Reach $17.1B by 2036

07/29/2026 | PRNewswire
The market is projected to grow from $6.6 billion in 2026 to $17.1 billion by 2036, registering a robust 10.0% CAGR during the forecast period.

Qnity Strengthens Long-Term Innovation and Advanced Packaging Roadmap

07/29/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced it is accelerating investments in next-generation technologies through access to a broad portfolio of research programs.

UMC Expands Fabs in Singapore and Tainan to Support AI Growth

07/29/2026 | BUSINESS WIRE
United Microelectronics Corporation (UMC), a leading global semiconductor foundry, announced that its Board of Directors has approved a phased expansion plan to meet growing customer demand.
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